Thermal analysis of DC/DC module - 文章详情页

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EI Scopus

摘要：

Ever-increasing　DC/DC　power　density　and　peak　temperature　challenge　its　reliability　and　performance.　Thermal　simulation　and　analysis　playa　significant　role　in　development　of　new　generation　of　DC/DC　package　design.　This　paper　presents　an　accurate　and　fast　approach　to　simulate　the　thermal　distribution　of　a　DC/DC　module.　The　thermal　distribution　is　simulated　with　ANSYS,　and　verified　by　infrared　thermal　images.　This　made　feasible　the　thermal　design　to　reduce　stressing　temperature　peaks,　so　improving　DC/DC　reliability　significantly.　©　2009　IEEE.

关键词：

Thermoanalysis Outages Failure (mechanical) Integrated circuits Failure analysis

作者机构：

[ 1 ] [Yuanchun, Wang]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Weidong, Ma]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Changzhi, Lv]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Zhiguo, Li]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Chunsheng, Guo]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Fei, Li]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China

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wych@emails.bjut.edu.cn

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