The　effects　of　the　moment,　axial　force　and　shear　force　induced　during　drop　impact　on　the　peeling　stress　of　the　solder　joints　were　investigated　by　a　2-D　beam　model　and　a　3-D　solid　model　of　board　level　electronic　package.　It　shows　that　the　peeling　stress　is　dominated　by　the　bending　stress　and　the　maximum　occurs　at　the　PCB　end.　Results　of　the　two　models　indicated　that　in　the　solder　joint　array　only　a　few　solder　joints　closed　to　the　end　of　the　package　are　stressed　and　the　most　solder　joints　inside　the　array　are　almost　stress-free.　Based　on　this　observation,　an　approach　was　proposed　to　reduce　the　computation　scale.　By　the　approach,　only　3　or　4　solder　joints　are　necessary　to　be　included　in　the　computational　model.　©2009　IEEE.