High speed deformation measurement of electronic packages by the digital image correlation method - 文章详情页

作者：

Li, Jiangang (Li, Jiangang.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.) | Jin, Ling (Jin, Ling.)

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EI Scopus

摘要：

4-point　dynamic　bending　tests　of　board　level　electronics　packages　were　carried　out　in　order　to　investigate　the　reliability　of　solder　joints.　A　high　speed　camera　and　the　digital　image　correlation　method　were　used　to　measure　the　deflection　of　the　PCB　board.　A　finite　element　model　to　simulate　the　test　was　built　up　and　was　validated　by　the　test　data.　©　2009　SPIE.

关键词：

Bending tests Correlation methods Printed circuit boards Finite element method High speed cameras Strain measurement Dynamics Image analysis

作者机构：

[ 1 ] [Li, Jiangang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Jin, Ling]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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