The　reliability　of　board　level　electronic　package　subjected　to　drop　impact　loadings　is　one　of　the　most　concerned　issues.　In　this　paper,　a　standard　board　level　drop　impact　test　was　modeled　as　double　cantilever　beam　model.　The　deflection　and　curvature　of　the　Printed　Circuit　Board　(PCB)　and　the　component　were　compared　with　that　derived　from　static　analysis　in　order　to　understand　the　influence　of　dynamic　response　of　the　PCB　on　the　solder　joints.　The　results　show　that　the　difference　of　flexibility　between　the　PCB　and　the　package　is　the　main　driver　for　solder　joint　stress;　the　dynamic　response　of　the　PCB　observably　affects　the　stress　in　solder　joints.　©2009　IEEE.