SHPB tests for mechanical behavior of lead-free solder alloys - 文章详情页

作者：

Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.) | Chen, Na (Chen, Na.)

收录：

EI Scopus

摘要：

Dynamic　behavior　of　solder　joints　in　microelectronic　packages　is　key　issue　for　drop/impact　reliability　design　of　mobile　electronic　products.　The　dynamic　mechanical　behavior　of　63Sn37Pb,　96.5Sn3.5Ag　and　96.5Sn3.0Ag0.5Cu　at　high　strain　rates　have　been　investigated　by　using　the　split　Hopkinson　pressure/tension　bar　testing　technique　(SHPB).　Stress-strain　relations　of　the　three　solders　were　obtained　at　strain　rates　of　600s-1,　1200s-1　and　2200s　-1,　respectively.　The　experimental　results　show　that　the　lead-free　solders　are　strongly　strain　rate　dependent.　96.5Sn3.5Ag　is　the　most　sensitive　to　strain　rate,　while　63Sn37Pb　is　the　least.　96.5Sn3.0Ag0.5Cu　has　the　greatest　yield　stress　and　tensile　strength.　Relations　of　the　yield　stress　and　the　tensile　strength　of　the　solders　with　strain　rate　were　fitted.　©　2009　SPIE.

关键词：

Product design Soldering Mechanical testing Soldered joints Silver alloys Stress-strain curves Strain rate Ternary alloys Copper alloys Tensile strength Yield stress Tin alloys Binary alloys Microelectronics Dynamics Lead-free solders

作者机构：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Chen, Na]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

qfei@bjut.edu.cn

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