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A novel segmented emitter structure with nonuniform finger length and spacing has been presented to alleviate adverse thermal effects in multi-finger SiGe BET power device. Considering the various thermal resistances of different components for the segmented multi-finger BET, an appropriate thermal model is developed. Using this model, the thermal simulation for a ten-finger power SiGe BET with segmented emitter structure is performed and the three-dimensional temperature distribution on emitter fingers is obtained. Compared with traditional emitter structure, the maximum junction temperature reduce significantly from 416.3K to 405K, the thermal resistance reduce from 154.67K/W to 140K/W, thus the thermal stability of improved structure is enhanced apparently. ©2009 IEEE.
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