FEM analysis of SnAgCu solder joint in flip chip - Details

Author：

Yan, Yongchang (Yan, Yongchang.) | Li, Xiaoyan (Li, Xiaoyan.) | Liu, Na (Liu, Na.)

Indexed by：

EI Scopus

Abstract：

SnAgCu　solder　is　fast　becoming　a　reality　in　electronic　manufacturing　during　to　marketing　and　legislative　pressure.　This　paper　studies　the　thermal　fatigue　life　of　Flip　Chip　by　the　application　of　thermal　fatigue　life　prediction　model.　The　required　life　prediction　model　for　SnAgCu　solder　joint　is　based　on　fatigue-creep　interaction　damage　theory.　In　same　test　condition,　the　actual　life　of　Flip　Chip　is　earned　from　the　other　paper.　The　different　between　the　actual　life　and　prediction　life　will　be　compared,　and　the　reason　of　difference　will　be　analyzed.　©　2009　IEEE.

Keyword：

Silver alloys Failure (mechanical) Ternary alloys Finite element method Lead-free solders Forecasting Predictive analytics Thermal fatigue Failure analysis Copper alloys Tin alloys Soldered joints Electronics industry Flip chip devices

Author Community：

[ 1 ] [Yan, Yongchang]Yongchang Yan, School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Leyuan, Chaoyang District, Beijing, lOO 124, China
[ 2 ] [Li, Xiaoyan]Yongchang Yan, School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Leyuan, Chaoyang District, Beijing, lOO 124, China
[ 3 ] [Liu, Na]Yongchang Yan, School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Leyuan, Chaoyang District, Beijing, lOO 124, China

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Related Keywords：

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Source ：

Year： 2009

Page： 418-422

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 3

Affiliated Colleges：

材料与制造学部材料科学与工程学院

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