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Author:

Liu, F.R. (Liu, F.R..) (Scholars:刘富荣) | Chan, K.C. (Chan, K.C..) | Tang, C.Y. (Tang, C.Y..) | Chen, J.M. (Chen, J.M..) (Scholars:陈继民)

Indexed by:

EI Scopus

Abstract:

Laser forming is a promising technology to deform the work pieces by thermal stress caused by laser irradiations. Up to date, considerable investigations have been carried out to clarify the process, however, much attention has been focused on monolithic alloys and relatively less work has been done on the MMCs. In the present study, interface debonding of MMCs in laser forming was experimentally and numerically investigated. A microstructure integrated 3D FEM was developed to simulate the deformation behavior of MMCs in laser forming. And a periodic multi-particle cell model was firstly used to determine the damage evolution under uniaxial tensile loading, where the onset of damage was assumed to follow a maximum normal stress criterion. The damage evolution of the MMCs was subsequently coupled to the numerical model to calculate the deformation behavior of the composite in laser forming. It was found that the simulated results were in reasonable good agreement with the experimental data. And some significant findings were discussed in the paper.

Keyword:

Forming Metallic matrix composites Deformation Debonding Particle reinforced composites Stress analysis

Author Community:

  • [ 1 ] [Liu, F.R.]Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hung Hom, Hong Kong
  • [ 2 ] [Liu, F.R.]Institute of Laser Engineering, Beijing University of Technology, 100124, Beijing, China
  • [ 3 ] [Chan, K.C.]Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hung Hom, Hong Kong
  • [ 4 ] [Tang, C.Y.]Advanced Manufacturing Technology Research Centre, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hung Hom, Hong Kong
  • [ 5 ] [Chen, J.M.]Institute of Laser Engineering, Beijing University of Technology, 100124, Beijing, China

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Source :

Year: 2009

Volume: 102

Page: 225-232

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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