This　paper　presents　initial　research　results　of　a　new　laser　crack-free　cutting　technique,　which　be　capable　of　cutting　ceramics　with　thickness　of　≥　10　mm　in　internal　straight　or　curve　trajectory　by　CO2　laser　at　higher　cutting　speed　of　about　25　∼　30　mm/min.　The　technique　is　originated　from　the　laser　continuous　piercing　full　through　the　workpieces　but　need　appropriate　time　shot　for　every　piercing　and　adaptation　on　processing　steps,　cycle　duty　and　gas　pressure　and　so　on.　With　low　frequency　of　30∼50　Hz,　low　duty　cycle　of　20∼50%,　piercing　time　of　0.1∼0.5　s　and　piercing　pitch　of　about　0.03∼0.05　mm　in　pulse　mode　operation,　crack-free　laser　cutting　of　ceramics　can　be　achieved.　By　the　study　on　Al2O3　and　SiC　ceramics　with　different　thickness　and　density,　it　was　concluded　that　the　new　laser　crack-free　cutting　technique　can　be　a　feasible　tool　for　successful　cutting　of　ceramics　in　complex　path,　even　for　3D　cutting.