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作者:

Li, Xiao-Yan (Li, Xiao-Yan.) | Yan, Yong-Chang (Yan, Yong-Chang.) | Liu, Na (Liu, Na.)

收录:

EI Scopus

摘要:

A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is σ=85.260.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=I .0689P-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test. © 2008 IEEE.

关键词:

Constitutive models Copper alloys Differential equations Elasticity Electronics packaging Lead-free solders Packaging Silver alloys Software testing Stress-strain curves Tensile testing Ternary alloys Thermodynamics Tin alloys Unloading

作者机构:

  • [ 1 ] [Li, Xiao-Yan]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China
  • [ 2 ] [Yan, Yong-Chang]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China
  • [ 3 ] [Liu, Na]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China

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年份: 2008

语种: 英文

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WoS核心集被引频次: 0

SCOPUS被引频次: 2

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