Study of plasticity damage mechanics constitutive model for SnAgCu solder joint - 文章详情页

作者：

Li, Xiao-Yan (Li, Xiao-Yan.) | Yan, Yong-Chang (Yan, Yong-Chang.) | Liu, Na (Liu, Na.)

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EI Scopus

摘要：

A　thermodynamics-based　damage　mechanics　rate　dependent　constitutive　model　is　used　to　simulate　experiments　conducted　on　thin　layer　eutectic　SnAgCu(SAC)　solder　joints.　The　non-damage　constitutive　is　measured　by　bulk　tensile　test.　The　relationship　between　true　stress　and　strain　is　σ=85.260.3536.　Damage　evolution　equation　is　proposed　based　Lemaitre　ductile　damage　theory　and　the　constant　in　the　equation　is　measured　by　unloading　elastic　modulus　method.　The　damage　evolution　equation　is　D=I　.0689P-0.0008.　Simulation　(using　software　Ansys　9.0)　of　shear　test　of　solder　joint　between　Cu　sticks　employing　damage　mechanics　rate　independent　constitutive　is　uniform　to　practicable　test.　©　2008　IEEE.

关键词：

Constitutive models Copper alloys Differential equations Elasticity Electronics packaging Lead-free solders Packaging Silver alloys Software testing Stress-strain curves Tensile testing Ternary alloys Thermodynamics Tin alloys Unloading

作者机构：

[ 1 ] [Li, Xiao-Yan]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China
[ 2 ] [Yan, Yong-Chang]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China
[ 3 ] [Liu, Na]School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100022, China

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