The study on the thermal behavior of packaged power LEDs - 文章详情页

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The　reliability　of　power　LEDs　has　strong　dependence　on　successful　package　thermal　management.　In　this　paper,　heating　response　curves　of　LEDs　were　recorded　by　the　temperature　sensitive　parameter　(TSP)　method　and　fast-switching　circuit　techniques.　It　provided　a　novel　method　to　analyze　thermal　resistance　composition　of　power　LED＇s　packaging.　Cover-and-block　method　was　presented　to　provide　a　correction　to　the　apparent　thermal　resistance　of　optical　devices,　and　an　electrical　method　to　obtain　radiant　efficiency　was　also　put　forward.　©　2008　IEEE.

关键词：

Efficiency Heat resistance Integrated circuits Light emitting diodes Reliability

作者机构：

[ 1 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Wang, Lu]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Xie, Xuesong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Gao, Lichao]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Meng, Haijie]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China

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