A　beam　model　of　board　level　electronic　package　was　used　to　investigate　effects　of　the　moment,　axial　force　and　shear　force　induced　during　drop/impact　on　the　peeling　stress　of　the　soldered　joints.　The　peeling　stresses　in　soldered　joints　were　evaluated　under　static　and　dynamic　bending　of　the　PCB.　It　shows　that　the　peeling　stress　is　dominated　by　the　bending　stress　and　the　maximum　occurs　at　the　PCB　end.　In　the　soldered　joint　array,　only　a　few　soldered　joints　closed　to　the　far　end　of　the　packaging　are　stressed　and　the　most　joints　inside　the　array　are　almost　stress　free.　Based　on　this　observation,　an　approach　was　proposed　to　reduce　the　computation　scale.　By　the　approach,　only　3　or　4　soldered　joints　are　necessary　to　be　included　in　the　computational　model.　©　2008　IEEE.