Dynamic behavior tests of lead-free solders at high strain rates by the SHPB technique - 文章详情页

作者：

Fei, Qin (Fei, Qin.) (学者：秦飞) | Tong, An (Tong, An.) | Na, Chen (Na, Chen.)

收录：

EI Scopus

摘要：

Dynamic　behavior　of　solder　joints　in　microelectronic　packages　is　key　issue　for　drop/impact　reliability　design　of　mobile　electronic　products.　The　dynamic　mechanical　behaviors　of　63Sn37Pb,　96.5Sn3.5Ag　and　96.5Sn3.0Ag0.5Cu　solder　alloys　at　high　strain　rate　were　investigated　by　using　the　split　Hopkinson　pressure/tension　bar　testing　technique.　Stressstrain　curves　of　the　three　materials　were　obtained　at　strain　rate　600　s-1,　1200　s-1　and　2200　s-1,　respectively.　The　experimental　results　show　that　all　the　three　materials　are　strongly　strain　rate　dependent.　Among　them　96.5Sn3.5Ag　is　the　most　sensitive　to　strain　rate,　while　96.5Sn3.0Ag0.5Cu　has　the　greatest　yield　stress　and　tensile　strength.　Relations　of　the　tensile　strength,　fracture　strain　and　yield　stress　of　the　materials　with　strain　rate　were　proposed　by　fitting　the　experimental　data.　©　2008　IEEE.

关键词：

Binary alloys Copper alloys Electronics packaging Lead-free solders Mechanical testing Microelectronics Packaging Product design Silver alloys Strain rate Tensile strength Ternary alloys Tin alloys Yield stress

作者机构：

[ 1 ] [Fei, Qin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Tong, An]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Na, Chen]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

通讯作者信息：

电子邮件地址：

qfei@bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至