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[会议论文]

Dynamic bending tests and numerical simulation of board level electronic package

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Author:

Qin, Fei (Qin, Fei.) (Scholars:秦飞) | Wang, Yngve (Wang, Yngve.) | Liu, Bin (Liu, Bin.) | Unfold

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EI Scopus

Abstract:

4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints. © 2008 IEEE.

Keyword:

Electronics packaging Bending tests Printed circuit boards High speed cameras Packaging

Author Community:

  • [ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Wang, Yngve]Intel Technology Development (Shanghai) Ltd., Shanghai 200131, China
  • [ 3 ] [Liu, Bin]Intel Technology Development (Shanghai) Ltd., Shanghai 200131, China
  • [ 4 ] [An, Tong]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China
  • [ 5 ] [Jin, Ling]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China

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Year: 2008

Language: English

Cited Count:

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SCOPUS Cited Count: 2

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