Peeling　stress　of　solder　joints　is　critical　to　assess　the　reliability　of　packages　under　drop/impact　loadings.　Numerical　simulation　is　one　important　tool　to　tackle　this　issue.　Usually　an　implicit　dynamic　transient　finite　element　(FE)　is　used　to　conduct　the　drop/impact　analysis　of　PCB　board　level　packages　under　a　specific　drop　condition.　However,　even　using　the　most　update　computer　this　kind　of　simulation　is　time　consuming.　Therefore　some　researchers　and　engineers　proposed　an　alternative　static　analysis　as　first　order　estimation　of　peeling　stress.　The　alternative　static　models　can　be　classified　into　two　types.　One　is　based　on　PCB　bending　moment　equivalent,　i.e,　let　the　bending　moment　of　PCB　in　the　static　model　equal　to　the　moment　in　a　prior　dynamic　analysis,　and　then　evaluate　peeling　stress　by　the　static　model.　Another　is　based　on　PCB　deflection　equivalent　in　which　the　PCB　deflection　in　the　static　model　identifies　to　the　greatest　deflection　of　PCB　in　dynamic　analysis.　From　the　view　of　that　the　peeling　stress　is　caused　by　the　bending　stiffness　difference　between　the　package　and　the　PCB　the　package　attached,　it　seems　that　the　deflection　equivalent　scheme　is　more　reasonable.　However,　there　is　no　research　reported　in　which　a　through　investigation　was　conducted　to　verify　the　effectiveness　of　the　static　model.　In　this　paper,　a　very　detailed　finite　element　model　of　PCB　board　and　BGA　package　was　constructed.　A　dynamic　drop/impact　simulation　of　the　board-level　package　was　conducted　by　LS-DYNA　and　Input-G　approach　under　the　drop　Condition　H　recommended　by　JEDEC　standard　JESD22-B111.　A　PCB　deflection　equivalent　static　analysis　was　conducted　also　in　order　to　investigate　the　difference　of　peeling　stress　between　the　dynamic　and　the　static　model.　©2007　IEEE.