Electromigration in lead-free Sn3.8AgO.7Cu solder reaction couple - 文章详情页

作者：

He, Hongwen (He, Hongwen.) | Xu, Guangchen (Xu, Guangchen.) | Hao, Hu (Hao, Hu.) | Guo, Fu (Guo, Fu.) (学者：郭福)

收录：

EI Scopus

摘要：

Electromigration　is　one　of　the　severe　reliability　problems　in　IC　progress.　In　this　paper,　the　electromigration　of　eutectic　Sn3.8AgO.7Cu　Solder　reaction　couples　were　studied　under　high　temperature　(150C)　and　high　current　density　(5　×　103　A/cm2)　in　three　days.　An　original　design　which　could　reduce　the　local　joule　heating　caused　by　current　crowding　was　produced.　Voltage　change　was　also　monitored　during　this　experiment.　Hillocks　and　valleys　were　found　at　the　anode　side　and　cathode　side　respectively.　Unlike　aging　test,　electromigration　could　promote　the　formation　of　intermetallic　compound　(IMC)　at　cathode　side　and　inhibit　the　formation　of　IMC　at　anode　side.　Cracks　also　appeared　along　the　cathode　side　after　electromigration　in　three　days,　but　they　were　not　leading　the　solder　reaction　couple　to　failure.　©2007　IEEE.

关键词：

Anodes Cathodes Electromigration Electronics packaging Lead-free solders Testing

作者机构：

[ 1 ] [He, Hongwen]College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 2 ] [Xu, Guangchen]College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 3 ] [Hao, Hu]College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 4 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China

通讯作者信息：

电子邮件地址：

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至