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作者:

Liu, Bendong (Liu, Bendong.) | Li, DeSheng (Li, DeSheng.) (学者:李德胜)

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EI Scopus

摘要:

A new optimization structure for micro electromagnetic relay is introduced based on the research done before. Three-dimensional structure and new fabrication process is adopted accordingly in the improved design. The new structure can decrease the leak of magnetic circuit and increase the magnetic force. An optimization armature is introduced in order to improve the electromagnetic attract force and decrease the rigidity of the armature. A micro electromagnetic relay is fabricated based on the MEMS technology. The size of the micro electromagnetic relay is about 5mm×5mm×0.4mm. The micro relay consists a lower magnetic circuit, a planar exciting coil and a permalloy cantilever. Anisotropie etching, electroplating, polyimide film patterning is adopted in the fabrication process. The exciting coil of the micro electromagnetic relay has 16 turns and the resistance of the coil is about 20Ω. The initial experiments show that the permalloy cantilever displacement can reach 20μm at a current and voltage of 250mA and 5V. © 2006 IEEE.

关键词:

Electromagnetism Optimization Etching MEMS Polymer films Magnetic circuits Electric relays

作者机构:

  • [ 1 ] [Liu, Bendong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100022, China
  • [ 2 ] [Li, DeSheng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100022, China

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年份: 2006

卷: 2006

页码: 480-484

语种: 英文

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SCOPUS被引频次: 3

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