Effect of loading mode, temperature and moisture on interface fracture toughness of silicon/underfill/silicon sandwiched system - 文章详情页

作者：

Song, G.Q. (Song, G.Q..) | Shi, X.Q. (Shi, X.Q..) | Qin, F. (Qin, F..) (学者：秦飞) | He, C.F. (He, C.F..) (学者：何存富)

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EI Scopus

摘要：

In　this　study,　fracture　tests　of　chip/underfill/chip　sandwiched　system　were　carried　out,　with　non-contact　and　non-destructive　digital　image　correlation　(DIC)　technique,　under　various　loading　angles　from　20°　to　90°　for　different　temperature　levels　of　25,　75　and　125°C　or　after　moisture　ageing　at　85°C/85%RH,　to　study　the　effects　of　loading　angle,　temperature　and　moisture　on　the　interface　fracture　toughness.　With　the　results,　the　mode　I　and　mode　II　critical　fracture　toughness　based　failure　assessment　diagrams　(FADs)　were　established　for　reliability　design　and　failure　assessment　of　underfill/chip　interface　at　different　thermal　cycling　loading　and　moisture　conditions.　©　2006　IEEE.

关键词：

Interfaces (materials) Moisture Thermal effects Microprocessor chips Fracture toughness Image processing Loads (forces) Correlation methods Failure (mechanical)

作者机构：

[ 1 ] [Song, G.Q.]School of Civil Engineering, Nanchang University, 339 East Beijing Rd., Nanchang, Jiangxi 330029, China
[ 2 ] [Shi, X.Q.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, No. 100, Pingleyuan, Chaoyang, Beijing 100022, China
[ 3 ] [Qin, F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, No. 100, Pingleyuan, Chaoyang, Beijing 100022, China
[ 4 ] [He, C.F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, No. 100, Pingleyuan, Chaoyang, Beijing 100022, China

通讯作者信息：

[song, g.q.]school of civil engineering, nanchang university, 339 east beijing rd., nanchang, jiangxi 330029, china

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