Improving bonding quality in MEMS using silicon/gold /glass bonding by laser - 文章详情页

作者：

收录：

EI Scopus

摘要：

Fusion　bonding　with　Nd:　YAG　laser　method　between　silicon　and　glass　at　low　temperature　has　been　successfully　demonstrated.　This　method　could　overcome　the　movable　mechanical　parts　damages　brought　by　the　electrostatics　force　in　MEMS　(Micro-electronic-machine-system-MEMS)　device　during　the　anodic　bonding.　What＇s　more,　it　could　make　silicon　wafer　and　glass　bonded　successfully　at　low　temperature　for　the　Au/Si　alloy　fusion　temperature　is　365°C.　©　2004　IEEE.

关键词：

Bonding Composition Laser beam effects Low temperature effects Microelectromechanical devices Neodymium lasers Scanning electron microscopy Silicon wafers

作者机构：

[ 1 ] [Yang, Daohong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China
[ 2 ] [Xu, Chen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China
[ 3 ] [Zhao, Linlin]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China
[ 4 ] [Zhao, Hui]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China
[ 5 ] [Huo, Wenxiao]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China
[ 6 ] [Shen, Guangdi]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing Optoelectronic Technology Laboratory, Beijing 100022, China

通讯作者信息：

电子邮件地址：

daohongyang@emails.bjut.edu.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至