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作者:

Lu, Changzhi (Lu, Changzhi.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | Wang, Dongfeng (Wang, Dongfeng.) | Zhu, Xiudian (Zhu, Xiudian.) | Fan, Zhifang (Fan, Zhifang.) | Morkoc, Hadis (Morkoc, Hadis.)

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摘要:

AlGaN/OaN double heterostructure high electron mobility transistor (DH-HEMT's) with a 2.0μm gate length and a 4μm channel length exhibiting good temperature characteristics has been demonstrated. The maximum drain current Ids and extrinsic transconductance Gm are 1300mA/mm 235mS/mm, 850mA/mm 174mS/mm and 475mA/mm 95mS/mm, respectively at T=-194°C, 20°C and 400°C. The temperature coefficient of I ds and Gm are -1.4mA/°C and -0.24mS/°C respectively. © 2004 IEEE.

关键词:

Electric currents Electric potential Gates (transistor) Heterojunctions High electron mobility transistors Molecular beam epitaxy Photoresistors Semiconducting aluminum compounds Thermal conductivity Transconductance

作者机构:

  • [ 1 ] [Lu, Changzhi]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 3 ] [Wang, Dongfeng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 4 ] [Zhu, Xiudian]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 5 ] [Fan, Zhifang]Department of Electric, Computer Microelectronics Laboratory, University of Illinois, Urbana, IL 61801
  • [ 6 ] [Morkoc, Hadis]Virginia Microelectronics Center, Virginia Commonwealth University, Richmond, VA 23284-3072

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年份: 2004

卷: 3

页码: 2284-2286

语种: 英文

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