Dissimilar　metal　joining　between　Al　and　Cu　is　effective　to　reduce　the　cost　and　weight　of　electrical　components.　In　this　study,　dissimilar　laser　lap　brazing　of　Al　containing　Ni　to　pure　Cu　was　conducted,　and　the　effect　of　the　addition　of　Ni　on　the　joint　strength　and　microstructure　at　the　dissimilar　interface　was　examined.　The　addition　of　Ni　higher　than　2.8　at.pct　improved　the　joint　strength　effectively,　even　though　the　thickness　of　the　IMC　layer　at　the　dissimilar　interface　increased.　The　addition　of　Ni　additionally　produced　not　only　(Ni,Cu)Al　particles　in　-Al2Cu　but　also　a　(Ni,Cu)Al　layer　at　the　-Al2Cu/(1)-Al4Cu9　interface.　This　study　implied　that　the　addition　of　Ni　to　Al　resulted　in　the　formation　of　a　(Ni,Cu)Al　layer　at　the　weakest　interface　between　-Al2Cu　and　(1)-Al4Cu9,　drastically　increasing　the　strength　of　the　Al/Cu　dissimilar　joint.