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A model of Heat source is presented for tunnel regeneration semiconductor laser diodes. Three-dimensional transient and steady-state temperature-distribution of the laser diode with two active regions is simulated by using the finite element method. It is found that the temperature increase of the active regions is small during the initial several microseconds. In the range between several microseconds and some ten milliseconds the temperature of the active regions increases significantly. At some hundred milliseconds a steady-state thermal distribution is nearly reached. It is in agreement with the measured data. The temperature of two active regions is the highest initially, but the temperature of the tunnel junction increase rapidly and is higher than the temperature of the active region close to the heat sink finally. The temperature of the rear facet increases much slowly for the asymmetric packaging along the resonator. Steady-state temperature distribution present that temperature of the active region close to the substrate is higher than that of the active region close to the heat sink, but the temperature difference is less than 0.3K. The highest temperature is in the stripe center of the front emitting facet of the active region close to the substrate.
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