The　microstructural　characterization　and　properties　of　solder　joints　made　from　lead-free　solder　alloys　SnAg3.0Cu0.5　and　SnAg1.0Cu0.5Bi1.0　(composition　given　in　weight　%)　with　Cu　plate　were　studied　in　this　work.　The　influence　of　Bi　addition　to　the　SAC　solder　was　studied.　The　melting　temperatures,　optical　microscopy,　EDX,　and　point　chemical　analyses　were　observed　and　evaluated.　Thermo-Calc　software　was　used　for　phase＇s　composition　prediction.　Altogether,　1500cycles　were　carried　out　for　the　thermal　cycling　test　in　the　range　from　+150　to　-40　degrees　C　where　the　solder　joints＇　reliability　was　assessed　due　to　practice　requirement.　Optical　microscopy　and　scanning　electron　microscopy　(EDX　microanalysis)　tests　were　used　for　the　evolution　of　microstructure　and　structural　integrity　of　thermal　cycled　solder　joints.