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作者:

Sun, Dawei (Sun, Dawei.) | Chong, Yong Bing (Chong, Yong Bing.) | Chen, Ke (Chen, Ke.) | Yang, Jinglei (Yang, Jinglei.)

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EI Scopus SCIE

摘要:

A new approach was developed to load 4,4'-bis-methylene cyclohexane diisocyanate in microcapsules, with outstanding stability in thermal and chemical environments, and excellent efficiency for both self-healing and self-lubricating uses. Well-dispersed microcapsules with diameter of 80 +/- 22 mu m and shell thickness of 3.8 +/- 0.2 mu m were produced with a core fraction of 74 +/- 1.3 wt% as determined by titration. In thermal environments, the microcapsules started to lose 5% mass at 230 degrees C, which was higher than the boiling point of pure HMDI and thermal decomposition temperature of shell material. In chemical environments (hexane, xylene, ethyl acetate and water), the impermeable microcapsules reserved more than 90% of original core material after 20 days immersion. More interestingly, final microcapsules survived successfully in acetone losing only 25% of core material after 24 h. Parameters including microcapsules size, concentrations, immersion durations and solvent polarity were investigated systematically to obtain the stability of microcapsules in organic solvents. The smart coatings (10 wt% microcapsules) showed outstanding self-healing anticorrosion efficiency in sodium chloride solutions, and their friction coefficient decreased by 80% than control samples.

关键词:

Double-layered shell Microcapsules Organic solvents resistance Self-healing Self-lubricating Water resistance

作者机构:

  • [ 1 ] [Sun, Dawei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China
  • [ 2 ] [Yang, Jinglei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China
  • [ 3 ] [Sun, Dawei]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Chong, Yong Bing]Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore
  • [ 5 ] [Chen, Ke]Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore, Singapore

通讯作者信息:

  • [Yang, Jinglei]Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Peoples R China

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来源 :

CHEMICAL ENGINEERING JOURNAL

ISSN: 1385-8947

年份: 2018

卷: 346

页码: 289-297

1 5 . 1 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:76

JCR分区:1

被引次数:

WoS核心集被引频次: 100

SCOPUS被引频次: 89

ESI高被引论文在榜: 0 展开所有

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