Experimental　study　was　performed　systematically　to　investigate　heat　transfer　characteristics　at　the　stagnation　point　from　a　simulated　microelectronic　chip　of　5　mm×5　mm　with　impinging　submerged　circular　jet,　using　R113　as　the　working　fluid.　Included　are　single-phase　convective　heat　transfer,　incipient　boiling　superheating,　nucleate　boiling　heat　transfer　and　burnout.　The　results　showed　that　exit　velocity　had　no　influence　on　incipient　boiling　point　and　fully-developed　nucleate　boiling　heat　transfer　curves,　and　that　single-phase　convective　heat　transfer　coefficient　and　critical　heat　flux　increased　with　enhanced　jet　exit　velocity,　while　temperature　overshoot　decreased.　While　exit　velocity　was　beyond　10　m·s-1,　the　high　heat　flux　portions　of　impingement　boiling　curves　needed　to　be　corrected　in　order　to　align　with　pool　boiling　curves　at　the　same　fluid　subcooling.