Scanning thermal probing of interfacial thermal conductivity of metal matrix composites - 文章详情页

作者：

Ji, Y. (Ji, Y..) | Zhong, T.-X. (Zhong, T.-X..) | Gao, X.-X. (Gao, X.-X..) | Shi, N. (Shi, N..) | Cui, Y. (Cui, Y..)

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摘要：

Interfacial　features　and　interfacial　thermal　conductivity　of　three　kinds　of　metal　matrix　composites　(MMC)　have　been　comparatively　studied　by　the　scanning　thermal　probing　with　the　micro-sized　special　resolution.　The　statistical　method　was　used　to　process　and　translate　topographic　and　thermal　voltage　data　of　scamming　thermal　microscopy　(SThM).　The　data　of　interfacial　width　and　interfacial　thermal　conductivity　were　obtained.　The　results　reveal　that　the　macro　thermal　conductivity　of　the　MMC　can　be　critically　dependent　on　the　reinforcing-matrix　interfacial　thermal　conductivity-.

关键词：

Interfacial thermal conductivity; Metal matrix composites (MMC); Scanning thermal microscope (SThM)

作者机构：

[ 1 ] [Ji, Y.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
[ 2 ] [Zhong, T.-X.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
[ 3 ] [Gao, X.-X.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
[ 4 ] [Shi, N.]School of Materials, Beijing Polytechnic University, Beijing 100022, China
[ 5 ] [Cui, Y.]Beijing Institute of Aeronautical Materials, Beijing 100095, China

通讯作者信息：

[Ji, Y.]School of Materials, Beijing Polytechnic University, Beijing 100022, China

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