Single-grain　or　tricrystal　joints　are　often　observed　in　Sn-based　Pb-free　solder　alloys,　such　as　Sn3.5Ag　and　Sn3.0Ag0.5Cu,　and　Sn　dendrites　tend　to　grow　in　the　[110]　and　[]　directions　in　these　solder　joints.　In　this　study,　electron　backscattering　diffraction　was　used　to　quantitatively　characterize　the　grain　orientations　of　a　reflowed　line-type　Sn3.0Ag3.0Bi3.0In　(SABI333)　solder　joint.　The　SABI333　solder　joint　was　composed　of　polycrystals,　and　polycrystals　with　misorientations　of　more　than　15A　degrees　were　separated　by　high-angle　grain　boundaries.　It　was　reasonable　to　assume　that　these　orientations　arose　from　Sn　dendrite　deviations　from　the　preferred　directions.　In　addition,　double　twinning　of　Sn　was　observed　in　the　SnAgCu　solder　alloy,　and　a　polycrystal　SABI333　solder　joint　was　formed　by　spreading　from　the　predominant　double　tricrystals　(with　five　orientations　in　the　preferred　[110]　and　[]　growth　directions).　Additionally,　during　electromigration　(EM),　the　near-pad-interface　small　grains　separated　by　high-angle　grain　boundaries　in　the　SABI333　solder　joint　tended　to　rotate,　and　the　rotation　caused　the　c-axis　to　be　perpendicular　to　the　current　direction.　Furthermore,　no　detectable　segregation　of　Ag　or　increase　in　the　thickness　of　the　interfacial　intermetallic　compounds　(IMCs)　occurred　in　the　SABI333　solder　joint　after　EM　for　168　h.　These　results　confirm　that　the　Sn　grain　orientations　in　the　joints　significantly　influence　the　reliability　of　the　solder　joints　under　service　conditions　that　promote　EM　and　that　polycrystal　SABI333　solder　joints　may　have　longer　EM　service　lifetimes　than　Sn3.5Ag　or　Sn3.0Ag0.5Cu　joints.