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作者:

Jia, Yuting (Jia, Yuting.) | Xia, Guodong (Xia, Guodong.) (学者:夏国栋) | Li, Yifan (Li, Yifan.) | Ma, Dandan (Ma, Dandan.) | Cai, Bo (Cai, Bo.)

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EI Scopus SCIE

摘要:

This paper constructs a three-dimensional model to numerically investigate the heat transfer and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins (MCPF) for inlet Re number ranging from 147 to 637. Firstly, the cases of micro pin fins located in the upstream (case1), middle (case2), downstream (case3) of microchannel and distributed throughout the microchannel (case4) are studied with fixed number of fins. Thereafter, the dimensionless parameters of relative fin diameter, relative space between the fins and relative height of the fin are studied to optimize the design. The variations of apparent friction factor f(app),(ave) and average Nusselt number Nu(ave) with inlet Re number have been conducted, and the thermal enhancement factor (eta) has been adopted as evaluation criteria to determine the best comprehensive thermal-hydraulic performance of MCPF. The results show that the microchannel inserted cone-shaped micro pin fins improves the heat transfer accompanied with a higher pressure drop as compared with the smooth rectangular (Rec) microchannel. Microchannel with uniform fins distribution (case4) has the largest eta and the bottom wall temperature is the lowest and well-distributed among all cases. When Re < 500, the overall thermal performance of case3 is better than case1 but when Re > 500, it displays a contrary tendency. The geometric configuration optimization of MCPF suggests that there is an optimum pin diameter, fin space and fin height that satisfy the demands of heat transfer and pressure drop.

关键词:

Cone-shaped micro pin fin Fluid flow Heat transfer enhancement Microchannel Numerical simulation

作者机构:

  • [ 1 ] [Jia, Yuting]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Xia, Guodong]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Yifan]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Ma, Dandan]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Cai, Bo]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China

通讯作者信息:

  • 夏国栋

    [Xia, Guodong]Beijing Univ Technol, Key Lab Enhanced Heat Thsnsfer & Energy Conservat, Minist Educ, Coll Environm & Energy Engn, Beijing 100124, Peoples R China

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来源 :

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

ISSN: 0735-1933

年份: 2018

卷: 92

页码: 78-89

7 . 0 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:76

JCR分区:1

被引次数:

WoS核心集被引频次: 71

SCOPUS被引频次: 60

ESI高被引论文在榜: 0 展开所有

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