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The laminar flow and heat transfer characteristics of fluid were numerically investigated through uniform and double-side heat flux 3D -IC(three-dimensional integration circuit) with interlayer heat-removal structure for heat transfer areas of 1 cm2 and volume flow ringing from 36 mL/min to 290 mL/min. 3D-IC with rectangle micro-channels and staggered micro-pin fins for pitches of 200 μm and structure heights of 200 μm was analyzed. Results show that inter-layer liquid cooling of 3D-IC with staggered micro-pin fins has better heat exchange effect than that with rectangle micro-channels. For the heat flux density of 1.25 MW/m2, the average temperature and maximum temperature of the heating surface are only 318.31, 323.16 K, decreased 12.31, 20.14 K than that with rectangle micro-channels at the volume flow of 290 mL/min, corresponding to about total power of 250W and volume heat source of 8.3 kW/cm3. © 2016, Editorial Department of Journal of Aerospace Power. All right reserved.
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