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作者:

Jiao, J. (Jiao, J..) | Li, Y. (Li, Y..) | Du, L. (Du, L..) | He, C. (He, C..) | Wu, B. (Wu, B..)

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摘要:

Aiming at the problem of the direction identification and quantitative detection of cracks in metal plate, a compound imaging method for plate structure is developed using array of Lamb waves. From the total matrix data of single mode Lamb waves acquired with ultrasonic array, the amplitude and sign information is extracted, which are used for total focus imaging and sign coherence imaging; and the sign coherence imaging is used to perform the weighted processing for the full focus imaging. The total array is divided into sub-arrays, the feature vector of each sub-array is calculated, and all of them are superimposed with weight to get the vector total focus imaging; Using the intensity information on the weighted total focus imaging and the direction information of the vector total focus imaging, the compound imaging is obtained, from which the orientation and dimension information of the crack is extracted. The experiment results demonstrate that the proposed compound imaging method using array of Lamb waves can achieve the orientation characteristic identification of multiple cracks in plate nicely, and the angle measurement errors is within 20%. The research provides a useful exploration for the crack defect identification and quantitative detection of metal plate. © 2016, Science Press. All right reserved.

关键词:

Compound imaging; Crack; Lamb wave; Total focus imaging; Ultrasonic array; Vector total focus imaging

作者机构:

  • [ 1 ] [Jiao, J.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Li, Y.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Du, L.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [He, C.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Wu, B.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of Technology, Beijing, 100124, China

通讯作者信息:

  • [Jiao, J.]College of Mechanical Engineering and Application Electronics Technology, Beijing University of TechnologyChina

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来源 :

Chinese Journal of Scientific Instrument

ISSN: 0254-3087

年份: 2016

期: 3

卷: 37

页码: 593-601

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