Effect of loading rates and solder thickness on shear behavior of SnAgCu/Cu lead-free solder joint - 文章详情页

作者：

Gao, R. (Gao, R..) | Li, X. (Li, X..) | Zhu, Y. (Zhu, Y..) | Wang, C. (Wang, C..)

收录：

Scopus PKU CSCD

摘要：

Single　shear　lap　SnAgCu/Cu　solder　joints　with　different　thicknesses　(0.1,　0.2,　0.3,　0.6　mm)　were　tested　at　various　loading　rates　(0.001,　0.01,　0.1,　1　mm/s)　with　an　Instron5948　Micro　Tester.　The　results　show　that　the　shear　strength　of　solder　joints　increased　with　the　increase　of　loading　rates,　and　increased　with　the　decrease　of　solder　thickness,　showing　an　apparent　size　effect.　Scanning　Electron　Microscopy　(SEM)　and　Energy　Dispersive　Spectrometer　(EDS)　were　used　to　analyze　the　morphology　of　shear　fracture　and　the　crack　initiation　on　the　surface　of　solder　joints,　the　crack　initiation　location　gradually　shifted　to　IMC　layer　from　the　solder　with　the　decrease　of　solder　thickness.　The　fracture　morphology　of　solder　joints　had　elongated　dimples　and　shear　planes,　and　the　failure　mechanism　was　micro-void　aggregation/pure　shear　hybrid　fracture.　©　2016,　Harbin　Research　Institute　of　Welding.　All　right　reserved.

关键词：

Crack initiation; Lead-free solder joint; Reliability; Shear property; Size effect

作者机构：

[ 1 ] [Gao, R.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Li, X.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Zhu, Y.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Wang, C.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China

通讯作者信息：

[Li, X.]College of Materials Science and Engineering, Beijing University of TechnologyChina

电子邮件地址：

xyli@bjut.edu.cn

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