• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Gao, R. (Gao, R..) | Li, X. (Li, X..) | Zhu, Y. (Zhu, Y..) | Wang, C. (Wang, C..)

Indexed by:

Scopus PKU CSCD

Abstract:

Single shear lap SnAgCu/Cu solder joints with different thicknesses (0.1, 0.2, 0.3, 0.6 mm) were tested at various loading rates (0.001, 0.01, 0.1, 1 mm/s) with an Instron5948 Micro Tester. The results show that the shear strength of solder joints increased with the increase of loading rates, and increased with the decrease of solder thickness, showing an apparent size effect. Scanning Electron Microscopy (SEM) and Energy Dispersive Spectrometer (EDS) were used to analyze the morphology of shear fracture and the crack initiation on the surface of solder joints, the crack initiation location gradually shifted to IMC layer from the solder with the decrease of solder thickness. The fracture morphology of solder joints had elongated dimples and shear planes, and the failure mechanism was micro-void aggregation/pure shear hybrid fracture. © 2016, Harbin Research Institute of Welding. All right reserved.

Keyword:

Crack initiation; Lead-free solder joint; Reliability; Shear property; Size effect

Author Community:

  • [ 1 ] [Gao, R.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Li, X.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Zhu, Y.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Wang, C.]College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China

Reprint Author's Address:

  • [Li, X.]College of Materials Science and Engineering, Beijing University of TechnologyChina

Show more details

Related Keywords:

Related Article:

Source :

Transactions of the China Welding Institution

ISSN: 0253-360X

Year: 2016

Issue: 2

Volume: 37

Page: 94-98

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

Online/Total:810/5260329
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.