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作者:

Guo, F. (Guo, F..) (学者:郭福)

收录:

Scopus

摘要:

Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. © 2007 Springer Science+Business Media, LLC.

关键词:

作者机构:

  • [ 1 ] [Guo, F.]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

通讯作者信息:

  • [Guo, F.]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

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来源 :

Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

专著名称: Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

期: Springer US

语种: 英文

被引次数:

WoS核心集被引频次: 0

SCOPUS被引频次: 17

ESI高被引论文在榜: 0 展开所有

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中文被引频次:

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