Sn-3.0Ag-0.5Cu　board-level　lead-free　solder　joint　drop　(1000g,　1　ms)/vibration　(15g,　25-35　Hz)　reliability　after　thermal　(-40-125　degrees　C,　1000　cycle)/isothermal　(150　degrees　C,　500　h)　cycling　was　reported　in　this　study.　The　failure　performance　of　solder　joint　and　testing　life　were　analyzed　under　design　six　testing　conditions　(1.　Single　drop　impact,　2.　Order　thermal　cycling　and　drop　impact,　3.　Order　isothermal　cycling　and　drop　impact,　4.　Single　vibration　5.　Order　thermal　cycling　and　vibration　6.　Order　isothermal　cycling　and　vibration).　The　results　revealed　that　the　pre-cracks　initiation　during　thermal　cycling　do　not　affect　the　solder　joint　drop　impact　reliability,　but　decrease　the　vibration　reliability.　The　formation　of　voids　weaken　both　drop　and　vibration　reliability　of　solder　joint.　After　thermal　cycling,　the　crack　initiated　from　beta-Sn　near　IMC　layer,　and　continued　propagation　through　the　same　path　when　under　second　in　order　vibration　impact.　But　propagation　path　turn　to　IMC　layer　when　under　second　in　order　drop　impact.　The　drop　life　increases　from　41　times　to　49　times,　and　vibration　life　decrease　from　77　min　to　45　min.　After　isothermal　cycling,　the　formation　of　voids　let　the　cracks　occurred　at　IMC　layer　under　second　in　order　no　matter　drop　impact　or　vibration.　The　drop　and　vibration　life　is　19　times　and　62　min　respectively.