收录:
摘要:
The intermetallic compounds (IMC) growth between lead-free solder and Cu pad has an important influence on the primary device reliability. Cu butt joints were welded by Sn3.8Ag 0.7Cu lead-free solder, and the joints were aged at 125, 150 and 175°C, aging time is 0, 24, 72, 144, 256 and 400 h. The growth and morphological characteristics of the IMCs were investigated by means of optical microscope, SEM and EDX. The diffusion constant and active energy of the IMCs were fitted by experimental data. The relationship between aging and the tensile strength of butt joints was also researched. During the process of aging the tensile strength enhances at first and then degrades. Aging could influence the form of fracture.
关键词:
通讯作者信息:
电子邮件地址: