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Author:

Xu, D.-X. (Xu, D.-X..) | Lei, Y.-P. (Lei, Y.-P..) (Scholars:雷永平) | Xia, Z.-D. (Xia, Z.-D..) | Guo, F. (Guo, F..) (Scholars:郭福) | Shi, Y.-W. (Shi, Y.-W..)

Indexed by:

Scopus PKU CSCD

Abstract:

This paper summarized the lead-free tendency and its relative legislation of the electronic products in worldwide. Subsistent patent documents and studies of soldering fluxes in different countries and regions were compared. The research status of soldering fluxes was also analyzed. The characteristic and requirement of the soldering fluxes for lead-free solders in microelectronics assembly were described in detail. Some pivotal problems on the development and study of the special soldering fluxes for lead-free solders were put forward, and the fluxes are required to be environmentally friendly. Finally, the trend and prospect of the soldering fluxes for lead-free solders were summed up in microelectronics assembly.

Keyword:

Electronics assembly; Lead-free solder; Soldering flux

Author Community:

  • [ 1 ] [Xu, D.-X.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China
  • [ 2 ] [Lei, Y.-P.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China
  • [ 3 ] [Xia, Z.-D.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China
  • [ 4 ] [Guo, F.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China
  • [ 5 ] [Shi, Y.-W.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China

Reprint Author's Address:

  • [Xu, D.-X.]College of Materials Science and Eng., Beijing Univ. of Technology, Beijing 100022, China

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Source :

Journal of Shanghai Jiaotong University

ISSN: 1006-2467

Year: 2007

Issue: SUPPL.

Volume: 41

Page: 53-57,61

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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