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作者:

Lei, Jun (Lei, Jun.) | Yun, Lili (Yun, Lili.) | Tinh Quoc Bui (Tinh Quoc Bui.)

收录:

EI Scopus SCIE

摘要:

In this paper, a dual boundary element computer program is developed for numerical simulation of a crack propagating in piezoelectric plates under a combined quasi-static electric and mechanical loading. To determine the crack growth path, two fracture criteria are taken into account: the maximum of hoop stress intensity factor (HSIF) and hoop mechanical strain energy release rate (HMERR). By using the displacement extrapolation method, these fracture parameters of any small kinked crack branch are obtained and validated by comparing with the available analytical results. The critical fracture loads for some test specimens are numerically analyzed based on the maximum HMERR fracture criterion. Different electrical boundary conditions on the crack faces are considered and checked with the experimental data. Finally, one crack or a pair of cracks propagating in infinite or finite piezoelectric plates is numerically simulated. The influences of the loading conditions, the anisotropic fracture toughness and the interaction between the cracks on the crack growth paths are also studied. The comparisons with the exiting finite element results show the accuracy and efficiency of the present BEM program for numerical simulation of crack growth in piezoelectric materials. (C) 2017 Elsevier Ltd. All rights reserved.

关键词:

Crack propagation Mechanical energy release rate Interaction BEM Hoop stress intensity factor Piezoelectric

作者机构:

  • [ 1 ] [Lei, Jun]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 2 ] [Yun, Lili]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 3 ] [Tinh Quoc Bui]Tokyo Inst Technol, Dept Civil & Environm Engn, Meguro Ku, 2-12-1-W8-22 Ookayarna, Tokyo 1528552, Japan

通讯作者信息:

  • [Lei, Jun]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China

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来源 :

ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS

ISSN: 0955-7997

年份: 2017

卷: 85

页码: 30-42

3 . 3 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:165

中科院分区:3

被引次数:

WoS核心集被引频次: 24

SCOPUS被引频次: 25

ESI高被引论文在榜: 0 展开所有

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