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作者:

Lv, M. (Lv, M..) | Zhang, X. (Zhang, X..) | Zhang, Y. (Zhang, Y..) (学者:张勇) | Xie, X. (Xie, X..) | Sun, J. (Sun, J..) | Wang, P. (Wang, P..) | Lv, C. (Lv, C..)

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摘要:

Background: Because of the damage induced by ionizing radiation, bipolar transistors in integrated voltage regulator could induce the current gain degradation and increase leakage current. This will bring serious problems to electronic system. Purpose: In order to ensure the reliability of the device work in the radiation environments, the device irradiation reinforcement technology is used. Methods: The characteristics of 60Co γ irradiation and annealing at different temperatures in bipolar transistors and voltage regulators (JW117) with different passive films for SiO2+BPSG+SiO2 and SiO2+SiN have been investigated. Results: The devices with BPSG film enhanced radiation tolerance significantly. Because BPSG films have better absorption for Na+ in SiO2 layer, the surface recombination rate of base region in a bipolar transistor and the excess base current have been reduced. It may be the main reason for BJT with BPSG film having a good radiation hardness. And annealing experiments at different temperatures after irradiation ensure the reliability of the devices with BPSG films. Conclusions: A method of improving the ionizing irradiation hardness of bipolar transistors is proposed. As well as the linear integrated circuits which containing bipolar transistors, an experimental basis for the anti-ionizing radiation effects of bipolar transistors is provided.

关键词:

Annealing; BPSG; Ionizing radiation; Passivation layer

作者机构:

  • [ 1 ] [Lv, M.]Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Zhang, X.]Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Zhang, Y.]Beijing Yan Dong Microelectronics Company Limited, Beijing 100015, China
  • [ 4 ] [Xie, X.]Beijing University of Technology, Beijing 100124, China
  • [ 5 ] [Sun, J.]Beijing University of Technology, Beijing 100124, China
  • [ 6 ] [Wang, P.]Beijing University of Technology, Beijing 100124, China
  • [ 7 ] [Lv, C.]Beijing University of Technology, Beijing 100124, China

通讯作者信息:

  • [Lv, M.]Beijing University of Technology, Beijing 100124, China

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来源 :

Nuclear Techniques

ISSN: 0253-3219

年份: 2013

期: 6

卷: 36

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