Dynamic fracturing of the intermetallic compound layer in solder joints under impact drop loading - 文章详情页

作者：

An, T. (An, T..) | Qin, F. (Qin, F..) (学者：秦飞)

收录：

Scopus PKU CSCD

摘要：

The　great　difference　of　the　failure　modes　between　lead-containing　and　lead-free　solder　joints　subjected　to　drop　impact　loading　has　not　been　well　understood.　In　this　paper,　a　feasible　finite　element　approach　is　proposed　to　model　the　cracking　behavior　of　lead-containing　and　lead-free　solder　joints　under　drop　impact　loading.　In　the　model,　the　damage　at　the　intermetallic　compound　layer/solder　bulk　interface　is　calculated　by　the　cohesive　zone　model,　and　the　failure　in　the　intermetallic　compound　layer　is　evaluated　by　computing　the　energy　release　rate.　The　numerical　simulation　result　shows　that,　for　the　lead-containing　Sn37Pb　solder　joint,　the　damage　in　the　intermetallic　compound　layer/solder　bulk　interface　initiates　earlier　and　much　greater　than　that　in　the　lead-free　Sn3.5Ag　solder　joint.　This　damage　can　relieve　the　stress　in　the　intermetallic　compound　layer　and　reduce　the　risk　of　intermetallic　compound　layer　fracturing　in　the　lead-containing　Sn37Pb　solder　joint.

关键词：

Cohesive zone model; Energy release rate; Fracture; Intermetallic compounds; Solder joint

作者机构：

[ 1 ] [An, T.]Advanced Electronic Packaging Technology and Reliability Laboratory, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Qin, F.]Advanced Electronic Packaging Technology and Reliability Laboratory, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

通讯作者信息：

秦飞
[Qin, F.]Advanced Electronic Packaging Technology and Reliability Laboratory, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

电子邮件地址：

qfei@bjut.edu.cn

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