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作者:

Xia, G.-D. (Xia, G.-D..) (学者:夏国栋) | Cheng, Y. (Cheng, Y..) | Huang, S.-G. (Huang, S.-G..) | Wang, W. (Wang, W..) (学者:王伟) | Jiao, Y.-G. (Jiao, Y.-G..)

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Scopus PKU CSCD

摘要:

In this paper, to solve the problem of LED heat dissipation, a integrated flat plate heat pipe was designed and the thermal performance was analyzed. An experimental rig was built to test the performance of the flat plate heat pipe. Project was designed to make sure the simulated heat source was insulated well. The simulated heater was fabricated to provide the heat flux which was needed in the experiment. By analyzing uncertainty of measurement, the results show that uncertainty of measurement is in the reasonable range. The influence of the heat power, filling ratio, and working fluid on the thermal performance of the flat plate heat pipe was studied. The experimental results show that the flat heat pipe has good temperature uniformity. The higher the power is, the lower the vapor chamber thermal resistance is. The optimal filling ratio of the flat heat pipe is 40% in the research. Among the three tested working fluids, the heat transfer performance of water proves to be the best. ©, 2015, Beijing University of Technology. All right reserved.

关键词:

Flat plate heat pipe; Heat transfer performance; LED

作者机构:

  • [ 1 ] [Xia, G.-D.]College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Cheng, Y.]College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Huang, S.-G.]College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Wang, W.]College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Jiao, Y.-G.]College of Environmental and Energy Engineering, Beijing University of Technology, Beijing, 100124, China

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来源 :

Journal of Beijing University of Technology

ISSN: 0254-0037

年份: 2015

期: 6

卷: 41

页码: 933-939

被引次数:

WoS核心集被引频次: 0

SCOPUS被引频次: 1

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