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作者:

Zhang, Yamin (Zhang, Yamin.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | Zhu, Hui (Zhu, Hui.) | Guo, Chunsheng (Guo, Chunsheng.) | Qiao, Yanbin (Qiao, Yanbin.) | Shao, Jin (Shao, Jin.) | Han, Xiaodong (Han, Xiaodong.) (学者:韩晓东)

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EI Scopus SCIE

摘要:

Thedynamic behavior of the thermal transport characteristics in the active region of AlGaN/GaN transistors was investigated experimentally. The transient temperature rise, the sectional temperature distribution, and the heat transport characteristics were all measured using the Schottky gate junction voltage characteristics method. The results show that three steps were observed in the transient temperaturerise and/or Schottkygate voltage drop curves. The transient temperature rise behavior at different positions in the active region under various power conditions is discussed in detail. In addition, the heat transport delay in the active region of the AlGaN/GaN transistors is also studied. The results indicated that the transport velocity of the heat is 1.47 m/s. This is important when changes occur to the electrical characteristic parameters of the device, because any heat transport-related delay would also induce associated delays in the changes to the electrical characteristic parameters in the AlGaN/GaN transistors.

关键词:

heat transport behavior Delay time reliability self-heating GaN-based transistors

作者机构:

  • [ 1 ] [Zhang, Yamin]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Zhu, Hui]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Guo, Chunsheng]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Qiao, Yanbin]Beijing Nari Smart Chip Microelect Technol Co Ltd, Beijing 100192, Peoples R China
  • [ 6 ] [Shao, Jin]Beijing Nari Smart Chip Microelect Technol Co Ltd, Beijing 100192, Peoples R China
  • [ 7 ] [Han, Xiaodong]Beijing Univ Technol, Inst Microstruct & Property Adv Mat, Beijing 100124, Peoples R China

通讯作者信息:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Lab Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

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来源 :

IEEE TRANSACTIONS ON ELECTRON DEVICES

ISSN: 0018-9383

年份: 2017

期: 5

卷: 64

页码: 2166-2171

3 . 1 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:165

中科院分区:3

被引次数:

WoS核心集被引频次: 7

SCOPUS被引频次: 8

ESI高被引论文在榜: 0 展开所有

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