• 综合
  • 标题
  • 关键词
  • 摘要
  • 学者
  • 期刊-刊名
  • 期刊-ISSN
  • 会议名称
搜索

作者:

Yu, H. (Yu, H..) | Feng, F. (Feng, F..) | Qin, F. (Qin, F..) (学者:秦飞) | Wu, W. (Wu, W..) | An, T. (An, T..) | Chen, P. (Chen, P..)

收录:

Scopus

摘要:

The thermal-mechanical reliability of the flip-chip with copper pillar bump is analyzed through finite element numerical simulation and Kriging response surface models optimization method. The results show that: the successive order of factors affecting the chip warpage is: die thickness, bump pitch, die thickness, substrate thickness, Cu Pillar height, Cu Pillar height, PI thickness, PI opening size; the successive order of factors affecting the stress is: PI opening size, bump pitch, PI thickness, die thickness, Cu Pillar height, substrate thickness; the objectives and constraints are explicated through Kriging model. In Kriging model, the quadratic form is adopted as regression function, Gaussian function is chosen as correlative function, and sequential quadratic programming is used to solve the problem. After optimization, the first principal stress is decreased significantly on the Low-K layer; meanwhile, chip warpage is under control. © 2015 IEEE.

关键词:

copper pillar bump; finite element numerical simulation; reliability; response surface models optimization

作者机构:

  • [ 1 ] [Yu, H.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 2 ] [Feng, F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 3 ] [Qin, F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 4 ] [Wu, W.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 5 ] [An, T.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 6 ] [Chen, P.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China

通讯作者信息:

电子邮件地址:

查看成果更多字段

相关关键词:

相关文章:

来源 :

16th International Conference on Electronic Packaging Technology, ICEPT 2015

年份: 2015

页码: 1219-1223

语种: 英文

被引次数:

WoS核心集被引频次: 0

SCOPUS被引频次: 1

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 0

在线人数/总访问数:456/4953095
地址:北京工业大学图书馆(北京市朝阳区平乐园100号 邮编:100124) 联系我们:010-67392185
版权所有:北京工业大学图书馆 站点建设与维护:北京爱琴海乐之技术有限公司