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Author:

Wang, Tongbo (Wang, Tongbo.) | Li, Bolong (Li, Bolong.) | Wang, Zhenqiang (Wang, Zhenqiang.) | Nie, Zuoren (Nie, Zuoren.) (Scholars:聂祚仁)

Indexed by:

EI Scopus SCIE

Abstract:

Isothermal compression testing of Ti-5.8Al-3Sn-5Zr-0.5Mo-1.0Nb-1.0Ta-0.4Si-0.2Er titanium alloy is performed on a Gleeble-3500 thermal simulator, and the corresponding microstructures are analyzed to clarify the softening mechanism and participates evolution. A constitutive equation compensated by strain has been established to describe the hot deformation behavior of the alloy. The deformation activation energies are calculated to be 369760.93-699310.86 J/mol in alpha+beta two-phase region and 268030.03-325800.41 J/mol in beta single-phase region. At a temperature of 880 degrees C, the main softening mechanism is the continuous dynamic recrystallization of lamellar a colony, controlled by the mechanical rotation of the sub-grain followed by dislocation climbing and annihilation by diffusion. Meanwhile, the dominant softening mechanism is the discontinuous dynamic recrystallization of b phase during the deformation at temperatures of 920 degrees C-1080 degrees C. Silicide containing Er with an average diameter of 20 nm is formed during the water quenching.

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Author Community:

  • [ 1 ] [Wang, Tongbo]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Li, Bolong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Wang, Zhenqiang]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Nie, Zuoren]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 聂祚仁

    [Li, Bolong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China;;[Nie, Zuoren]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

JOURNAL OF MATERIALS RESEARCH

ISSN: 0884-2914

Year: 2017

Issue: 8

Volume: 32

Page: 1517-1527

2 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:287

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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