Three-dimension　finite　element　modeling　is　used　to　simulate　and　compare　the　current　density,　temperature　and　the　gradients　of　distribution　in　Copper-filled　interconnects　via　hole　structure.　To　the　same　barrier　material,　the　via　hole　with　different　slope　is　simulated.　The　result　of　the　simulation　shows　that　optimizing　the　slope　of　the　via　hole　and　selecting　the　barrier　material　will　improved　the　interconnect　reliability.　All　these　provide　valuable　reference　to　the　design　of　the　via　hole.