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学者姓名：秦飞
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摘要 ：
Copper filled through silicon via (TSV-Cu) is a crucial technology for chip stacking and three-dimensional (3D) vertical packaging. The multiple thermal loadings caused by the annealing process and deposition of interconnected dielectric layers lead to continuous TSV-Cu protrusions, which can affect its reliability severely. In this paper, the relationship between second protrusion height of TSV-Cu and its microstructur characteristics during double annealing is quantitatively investigated. It is found that grain size of TSV-Cu after annealing once is larger, and the second protrusion value under additional annealing can be greatly reduced. The reduction phenomenon of second protrusion is relative to the microstructure characteristics such as <111> texture and Sigma 3 grain boundary type. In addition, stress and strain are analyzed by finite element analysis (FEA) to reveal the reduction mechanisms of the second protrusion height of TSV-Cu during double annealing. The initial residual stress of fabricated TSV-Cu and its mechanical property parameters measured by nanoindentation test are incorporated in FEA. The main results show that additional thermal loading leads to a smaller increase of equivalent plastic strain (PEEQ) and von Mises stress if the TSV-Cu is annealed firstly at a high temperature of 400 degrees C. This verifies the second protrusion tendency of TSV-Cu, and explains the reduction mechanisms of the second protrusion height of TSV-Cu.
关键词 ：
mechanical properties mechanical properties microstructure microstructure protrusion protrusion Through-silicon-via copper (TSV-Cu) Through-silicon-via copper (TSV-Cu) double annealing double annealing
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| GB/T 7714 | Zhang, Min , Qin, Fei , Chen, Si et al. Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) : 2433-2449 . |
| MLA | Zhang, Min et al. "Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes" . | JOURNAL OF ELECTRONIC MATERIALS 51 . 5 (2022) : 2433-2449 . |
| APA | Zhang, Min , Qin, Fei , Chen, Si , Dai, Yanwei , Chen, Pei , An, Tong . Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes . | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) , 2433-2449 . |
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摘要 ：
In this paper, the effect of different surface finish metallization layers (Cu, Ni, Au and Ag) on the shearing fracture toughness of sintered Ag bonded joints under various sintering temperatures is investigated based on end-notch flexure (ENF) test. The results show that the shearing fracture toughness for different kinds of specimens all increase with the sintering temperature augment. The sintered Ag/Ag joint shows the highest shearing fracture toughness while the sintered Ag/Ni joint shows the lowest. The average shearing fracture toughness of the Ag/Cu joint is very close to the Ag/Au joint when sintered from 240 ?& nbsp;to 280 ?, whereas the former became much higher when sintered under 300 ?. By statistically analysis of crack propagation paths, interface microstructure characteristics, and interface reaction, it is found that the main factors affecting the discrepancy of the shearing fracture toughness for different metallized layers are the interface connection ratio and contact angle. A higher interface connection ratio and lower contact angle can increase the actual crack resistance and lower down stress concentration at the bonding interface, which leads to the discrepancy of shearing fracture toughness correspondingly. The different inter-diffusion rates for Ag and various metallization layers are also clarified. This study could deepen the understanding of the metallization layer effect on the shearing fracture behaviors of sintered silver bonded joints.
关键词 ：
Metallization layers Metallization layers Microstructure Microstructure Sintered Ag Sintered Ag Interface property Interface property Shearing fracture toughness Shearing fracture toughness
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| GB/T 7714 | Zhao, Shuai , Dai, Yanwei , Qin, Fei et al. Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints [J]. | ENGINEERING FRACTURE MECHANICS , 2022 , 264 . |
| MLA | Zhao, Shuai et al. "Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints" . | ENGINEERING FRACTURE MECHANICS 264 (2022) . |
| APA | Zhao, Shuai , Dai, Yanwei , Qin, Fei , Li, Yanning , An, Tong , Gong, Yanpeng . Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints . | ENGINEERING FRACTURE MECHANICS , 2022 , 264 . |
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摘要 ：
对塑封球栅阵列(PBGA)封装器件Sn37Pb焊点进行了正弦振动、随机振动实验,得到各个载荷下焊点的疲劳寿命结果。建立了三维有限元模型,进行与实验条件一致的有限元分析,计算焊点的应力;将实验结果与有限元计算相结合,并基于Steinberg寿命预测模型,发展了随机振动载荷下焊点疲劳寿命预测方法。结果表明,疲劳寿命模型预测结果与实验结果吻合较好,该方法可应用于PBGA封装焊点在随机振动载荷下的疲劳寿命评估,为PBGA封装器件的设计与使用提供指导。
关键词 ：
寿命预测 寿命预测 Steinberg模型 Steinberg模型 随机振动 随机振动 有限元分析(FEA) 有限元分析(FEA) 塑封球栅阵列(PBGA)封装 塑封球栅阵列(PBGA)封装
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| GB/T 7714 | 秦飞 , 别晓锐 , 陈思 et al. 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 [J]. | 振动与冲击 , 2021 , 40 (02) : 164-170 . |
| MLA | 秦飞 et al. "随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型" . | 振动与冲击 40 . 02 (2021) : 164-170 . |
| APA | 秦飞 , 别晓锐 , 陈思 , 安彤 . 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 . | 振动与冲击 , 2021 , 40 (02) , 164-170 . |
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摘要 ：
本文系统报告了近期作者在蠕变切口断裂领域所做的工作,主要包括得到了高温蠕变条件下V型切口尖端的一阶渐近解和二阶渐近解,给出了不同切口和不同蠕变指数条件下V型切口尖端的特征值和特征分布函数。同时提出了蠕变V型切口尖端的断裂参量K(t)-积分,给出了不同切口尖端场不同阶次幅值系数之间的关系。将广义切口应力强度因子扩展推广到蠕变切口断裂问题,同时提出了针对V型切口的路径无关断裂参量C_V-积分。厘清了C_V-积分与C(t)-积分的异同。针对蠕变V型切口问题,提出了基于应变能率密度的断裂判据,该方法能够很好地阐释蠕变条件下切口问题的断裂判据,并给出了蠕变切口断裂韧度与蠕变裂纹断裂韧度的关系。本文所发展...
关键词 ：
断裂准则 断裂准则 Ⅴ型切口 Ⅴ型切口 断裂参量 断裂参量 渐近解 渐近解 蠕变 蠕变
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| GB/T 7714 | 代岩伟 , 刘应华 , 秦飞 et al. 幂律蠕变V型切口断裂——从尖端场到断裂准则 [C] //压力容器先进技术——第十届全国压力容器学术会议论文集（上） . 2021 . |
| MLA | 代岩伟 et al. "幂律蠕变V型切口断裂——从尖端场到断裂准则" 压力容器先进技术——第十届全国压力容器学术会议论文集（上） . (2021) . |
| APA | 代岩伟 , 刘应华 , 秦飞 , 陈浩峰 . 幂律蠕变V型切口断裂——从尖端场到断裂准则 压力容器先进技术——第十届全国压力容器学术会议论文集（上） . (2021) . |
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摘要 ：
等几何边界元法(IGABEM)具有边界元法的计算优势(只需在模型边界离散,降低问题维数,计算精度高等),同时可以实现CAD/CAE的无缝集成,提高分析效率。本文采用IGABEM对IGBT的DBC基板进行传热分析,得到其温度分布,同时研究陶瓷层厚度变化对结构中温度的影响。结果表明:固定铜层厚度时,适当减小陶瓷层厚度对结构是有益的。
关键词 ：
温度分布 温度分布 等几何边界元法 等几何边界元法 DBC基板 DBC基板
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| GB/T 7714 | 郭雨博 , 宇慧平 , 秦飞 et al. 基于等几何边界元法对IGBT基板的热分析 [C] //北京力学会第二十七届学术年会论文集 . 2021 . |
| MLA | 郭雨博 et al. "基于等几何边界元法对IGBT基板的热分析" 北京力学会第二十七届学术年会论文集 . (2021) . |
| APA | 郭雨博 , 宇慧平 , 秦飞 , 公颜鹏 . 基于等几何边界元法对IGBT基板的热分析 北京力学会第二十七届学术年会论文集 . (2021) . |
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摘要 ：
随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型
关键词 ：
Steinberg模型 Steinberg模型 塑封球栅阵列(PBGA)封装 塑封球栅阵列(PBGA)封装 寿命预测 寿命预测 有限元分析(FEA) 有限元分析(FEA) 随机振动 随机振动
引用：
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| GB/T 7714 | 秦飞 , 别晓锐 , 陈思 et al. 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 [J]. | 秦飞 , 2021 , 40 (2) : 164-170 . |
| MLA | 秦飞 et al. "随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型" . | 秦飞 40 . 2 (2021) : 164-170 . |
| APA | 秦飞 , 别晓锐 , 陈思 , 安彤 , 振动与冲击 . 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 . | 秦飞 , 2021 , 40 (2) , 164-170 . |
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摘要 ：
本文采用鼓泡法实验,基于双薄膜理论模型,已知黄铜的弹性模量的情况下,结合黄铜-聚酰亚胺(PI)双层薄膜测试实验计算出PI膜的弹性模量,并与纳米压痕测得的PI膜的弹性模量进行对比,完成了鼓泡法测量双层薄膜中未知薄膜力学性能方法的验证。实验结果表明,鼓泡实验测得PI膜的弹性模量与纳米压痕测得的弹性模量具有一致性。
关键词 ：
弹性模量 弹性模量 纳米压痕 纳米压痕 鼓泡法 鼓泡法 双层薄膜 双层薄膜
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| GB/T 7714 | 李想 , 秦飞 , 陈沛 . 鼓泡法测试电子封装材料力学性能的方法研究 [C] //北京力学会第二十七届学术年会论文集 . 2021 . |
| MLA | 李想 et al. "鼓泡法测试电子封装材料力学性能的方法研究" 北京力学会第二十七届学术年会论文集 . (2021) . |
| APA | 李想 , 秦飞 , 陈沛 . 鼓泡法测试电子封装材料力学性能的方法研究 北京力学会第二十七届学术年会论文集 . (2021) . |
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摘要 ：
Shearing fracture toughness of sintered silver (Ag) is an important parameter to reflect its shearing resistance. In this paper, mode II fracture toughness of sintered Ag is investigated based on end-notched flexure (ENF) test. Various sintering conditions are adopted to study the effect of sintering parameters on mode II fracture toughness of sintered Ag. The results show that the fracture toughness of sintered Ag increases rapidly with the increase of sintering temperature and holding time. Three shearing crack types are confirmed, i.e., interface delamination, tunneling cracking and cohesive cracking, and the cracking type varies from "interface delamination" or "tunneling cracking" to "cohesive cracking" with the increase of sintering temperature and holding time. An empirical equation is proposed to predict the mode II fracture toughness of sintered Ag. Through statistics investigation on microstructure evolution, it is found that the shearing fracture toughness heightens with enlargement of the Ag particle size, increase of the particle shape form factor, and decrease of the porosity. This study provides an alternative method to rigorously evaluate the shearing fracture toughness of die-attach materials in electronics packaging.
关键词 ：
ENF test ENF test Microstructure Microstructure Mode II fracture Toughness Mode II fracture Toughness Sintered Ag Sintered Ag Sintering parameter Sintering parameter
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| GB/T 7714 | Zhao, Shuai , Dai, Yanwei , Qin, Fei et al. On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters [J]. | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 2021 , 823 . |
| MLA | Zhao, Shuai et al. "On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters" . | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 823 (2021) . |
| APA | Zhao, Shuai , Dai, Yanwei , Qin, Fei , Li, Yanning , Liu, Lingyun , Zan, Zhi et al. On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters . | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING , 2021 , 823 . |
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摘要 ：
Grinding force is a crucial factor that affects the machining accuracy, wheel wear and the material removal efficiency for precision machining of semiconductor materials under nanometer accuracy. However, due to the complex rotational motion of both the grinding wheel and wafer workpiece, in situ measurement of the grinding force in wafer self-rotating grinding is still a big challenge. In this paper, a novel grinding force measurement method in silicon wafer grinding process is developed. The method is achieved by embedding four thin film force sensors into a self-designed force measurement device and real-time monitoring through wireless signal transmission. Based on this method, the grinding force under 5 groups of process parameters are measured. For the first time, the variations of grinding force during the whole grinding process are revealed real-timely. Effects of process parameters, i.e. spindle rotational speed and feed rate, on grinding force are investigated, and the parameters are also optimized based on the theory of specific grinding energy. The test results show that the force measurement method has the advantages of high precision, reliable and convenient implementation. (C) 2020 Elsevier Ltd. All rights reserved.
关键词 ：
Grinding force Grinding force Materials removal Materials removal Process parameter Process parameter Self-rotating grinding Self-rotating grinding Silicon wafer Silicon wafer Specific grinding energy Specific grinding energy
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| GB/T 7714 | Qin, Fei , Zhang, Lixiang , Chen, Pei et al. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process [J]. | MECHANICAL SYSTEMS AND SIGNAL PROCESSING , 2021 , 154 . |
| MLA | Qin, Fei et al. "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process" . | MECHANICAL SYSTEMS AND SIGNAL PROCESSING 154 (2021) . |
| APA | Qin, Fei , Zhang, Lixiang , Chen, Pei , An, Tong , Dai, Yanwei , Gong, Yanpeng et al. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process . | MECHANICAL SYSTEMS AND SIGNAL PROCESSING , 2021 , 154 . |
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摘要 ：
The sinusoidal and random vibration tests of Sn37Pb soldered plastic ball grid array (PBGA) assemblies were conducted to obtain the vibration lifetime of solder joints. A finite element analysis (FEA) was performed to obtain the maximum stresses at critical solder joints. A method was proposed for the vibration lifetime prediction of PBGA solder joints based on vibration failure tests, FEA and an adjusted Steinberg fatigue life prediction model. The results show the model is effective in predicting the fatigue life of solder joints under random vibration condition. The methodology can be applied to provide models and tools for the thermo-mechanical reliability design of PBGA packaging. © 2021, Editorial Office of Journal of Vibration and Shock. All right reserved.
关键词 ：
Ball grid arrays Ball grid arrays Electronics packaging Electronics packaging Forecasting Forecasting Lead alloys Lead alloys Predictive analytics Predictive analytics Soldered joints Soldered joints Thermal fatigue Thermal fatigue Tin alloys Tin alloys
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| GB/T 7714 | Qin, Fei , Bie, Xiaorui , Chen, Si et al. Vibration lifetime modelling of PBGA solder joints under random vibration loading [J]. | Journal of Vibration and Shock , 2021 , 40 (2) : 164-170 . |
| MLA | Qin, Fei et al. "Vibration lifetime modelling of PBGA solder joints under random vibration loading" . | Journal of Vibration and Shock 40 . 2 (2021) : 164-170 . |
| APA | Qin, Fei , Bie, Xiaorui , Chen, Si , An, Tong . Vibration lifetime modelling of PBGA solder joints under random vibration loading . | Journal of Vibration and Shock , 2021 , 40 (2) , 164-170 . |
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