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学者姓名：郭福
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Abstract ：
Integrated circuit systems are always suffering the temperature cycling environment caused by frequent power on and off. Mismatch in thermal expansion coefficients among chip package components will cause severe cyclic stress to the solder joints. During thermal fatigue, ll-Sn grains tended to generate thermal fatigue cracks at the grain boundaries. This work proposed a strategy of using amorphous Co-15 at.% P coating as the interface layer to inhibit the initiation and propagation of thermal fatigue cracks and improve the shear strength of solder joints by numerous endogenous CoSn3 laths. Mechanistically, based on the amorphous structure of the Co-P coating, Co atoms would massively and rapidly diffuse into the molten solder during the liquid-solid diffusion stage of reflow soldering, and the eutectic solidification together with ll-Sn spontaneously precipitated numerous laths of CoSn3 intermetallic compounds (IMC), which were evenly distributed and became the skeleton of the solders. The skeleton-like CoSn3 laths with high elastic modulus were the reinforcing phase of Sn-based solder, but also refined the grains of ll-Sn. The refinement of ll-Sn grains and the strengthening of CoSn3 laths played an important role in inhibiting the initiation and propagation of thermal fatigue cracks. In addition, a discontinuous Co-Sn IMC layer was formed between the amorphous Co-P and the solder. The alternating appearance of CoSn3 and relatively soft ll-Sn at the interface avoided the generation of cracks at the interface during temperature cycling.
Keyword ：
Diffusion Diffusion Co -P coatings Co -P coatings Thermal fatigue Thermal fatigue Temperature cycling Temperature cycling Intermetallic compounds Intermetallic compounds Solder joints Solder joints
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| GB/T 7714 | Liu, Shuang , Ma, Limin , Geng, Zelin et al. A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths [J]. | MATERIALS CHARACTERIZATION , 2024 , 209 . |
| MLA | Liu, Shuang et al. "A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths" . | MATERIALS CHARACTERIZATION 209 (2024) . |
| APA | Liu, Shuang , Ma, Limin , Geng, Zelin , Wang, Yuwei , Zhen, Cheng , Li, Dan et al. A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths . | MATERIALS CHARACTERIZATION , 2024 , 209 . |
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Abstract ：
Currently, three-dimensional packaging (3D packaging) is used as the most feasible technological way to break Moore's law. In 3D packaging, three different sizes of solder joints must work together to achieve highly integrated vertical interconnects. This architecture needs to be realized by multiple reflow in industrial production. Therefore, it is necessary to choose three solders with different melting points. In order to further extend the reflow temperature range and increase the flexibility of 3D integration, the development of low melting point solders is required.SnBi solder joints often suffer from brittle fracture due to the inherent brittleness of Bi, and SnIn solder joints is limited in its low tensile strength. Therefore, a series of SnBiIn alloys with different ratios were prepared. During the composition design, orthogonal experimental method was used to determine composition ratios. The effects of different composition on the micro-morphology as well as the mechanical properties of SnBiIn alloys were investigated. Samples were prepared using a vacuum induction furnace and the microstructure of the samples was analyzed. The mechanical properties of the alloys with different compositions were measured by tensile test. The results of this study provide a research basis for the design of low melting point solder.
Keyword ：
Low melting point Low melting point Sn-Bi-In alloy Sn-Bi-In alloy mechanical properties mechanical properties microstructure microstructure Composition design Composition design
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| GB/T 7714 | Wang, Xuechi , Ji, Xiaoliang , Wang, Yishu et al. Study of multi principal element solders with low melting point for 3D electronic packaging [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Wang, Xuechi et al. "Study of multi principal element solders with low melting point for 3D electronic packaging" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Wang, Xuechi , Ji, Xiaoliang , Wang, Yishu , Guo, Fu , Yuan, Hao , Qi, Yu . Study of multi principal element solders with low melting point for 3D electronic packaging . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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Abstract ：
Lightweight carbon fibers with high mechanical performance are referred to as an ideal reinforcement for an extensive variety of composite materials. However, the addition of carbon fibers into electronic interconnection solders is extremely limited so that the expected reinforcement in the mechanical properties of the composite solder joints has not been completely realized. Here, we used magnetic fields to align Ni-coated carbon fibers in the Sn-3.0Ag-0.5Cu solder vertically with the Cu substrate and prepared the oriented composite solder joints. We achieved a further improvement in the shear performance of composite solder joints (similar to 58 MPa) with a small addition of Ni-coated carbon fibers (0.5 wt%), which is 25% higher than that of pristine joints. It is found that these vertically oriented carbon fibers changed the propagation path of shear cracks and thus increased the shear resistance. Ni-coated carbon fibers also promoted nucleation of interfacial Cu6Sn5 in the solder joints during reflow, but prevented the formation of brittle Cu3Sn phase during isothermal aging, thus ensuring the high shear strength of composite solder joints after isothermal aging. This success provides a new pathway to fabricate a strong composite solder joint with a limited addition of reinforcements by aligning their orientation.
Keyword ：
Composite solders Composite solders Ni-coated short carbon fibers Ni-coated short carbon fibers Magnetic alignment Magnetic alignment Shear strength Shear strength
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| GB/T 7714 | Liu, Aiwei , Ji, Xiaoliang , Du, Yihui et al. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field [J]. | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 326 . |
| MLA | Liu, Aiwei et al. "Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field" . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 326 (2024) . |
| APA | Liu, Aiwei , Ji, Xiaoliang , Du, Yihui , Wang, Yishu , Wu, Yufeng , Guo, Fu . Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 326 . |
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Abstract ：
本发明公开了一种金属陶瓷涂层及其制备方法，该金属陶瓷涂层是采用激光熔融方法将混合粉体熔覆在基体上得到的，以所述混合粉体的总重量为100％计，所述混合粉体包括60.0％‑67.7％的Ni、20.5‑22.5wt％的Cr、3.2‑4.0wt％的Nb、8.1‑9.5wt％的Mo和0.5‑1.5wt％的Al2O3。本发明金属陶瓷涂层具有良好的耐高温性、抗氧化性、耐腐蚀性、可加工性能，同时金属陶瓷涂层具备耐水蒸气腐蚀性能以及较高的涂层强度。
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| GB/T 7714 | 吴玉锋 , 吴旭明 , 王朝辉 et al. 一种金属陶瓷涂层及其制备方法 : CN202310937891.2[P]. | 2023-07-28 . |
| MLA | 吴玉锋 et al. "一种金属陶瓷涂层及其制备方法" : CN202310937891.2. | 2023-07-28 . |
| APA | 吴玉锋 , 吴旭明 , 王朝辉 , 郭福 , 李彬 , 李林聪 . 一种金属陶瓷涂层及其制备方法 : CN202310937891.2. | 2023-07-28 . |
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Abstract ：
本发明公开了一种新型低熔点VC均热板用铜基钎料焊膏，涉及材料制备与连接领域，该焊膏中的铜基钎料成分质量占比为Cu67.5～67.9％，Sn22.6～23.0％，Ni3.7～3.9％，P5.6～5.8％，本发明利用金属锡对PH600铜基钎料进行成分调整，在保证使用性能良好的前提下，使得焊膏的熔点相对较低，同时克服了铜基钎料作为硬钎料熔点高且容易氧化的缺陷，具有节约能源、降低成本的优点。
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| GB/T 7714 | 郭福 , 吕伊铭 , 汉晶 et al. 一种新型低熔点VC均热板用铜基钎料焊膏 : CN202310227613.8[P]. | 2023-03-10 . |
| MLA | 郭福 et al. "一种新型低熔点VC均热板用铜基钎料焊膏" : CN202310227613.8. | 2023-03-10 . |
| APA | 郭福 , 吕伊铭 , 汉晶 , 马立民 , 晋学轮 , 李腾 et al. 一种新型低熔点VC均热板用铜基钎料焊膏 : CN202310227613.8. | 2023-03-10 . |
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Abstract ：
本发明提供了银纳米颗粒及采用醌类化合物调控多元醇还原法制备银纳米颗粒的方法，属于纳米材料制备技术领域。本发明将醌类化合物、聚N‑乙烯基吡咯烷酮、银源、添加剂与多元醇化合物混合，得到混合原料液；醌类化合物、聚N‑乙烯基吡咯烷酮、银源、添加剂与多元醇化合物的用量比为(0.02～0.25)mol：(0.01～2)mol：(0.01～0.1)mol：(0.00001～0.0001)mol：1L；将混合原料液在110～180℃条件下进行还原反应，得到右三角双锥银纳米颗粒和/或五边形银纳米棒。本发明采用一锅法能够制备得到右三角双锥银纳米颗粒和/或五边形银纳米棒，操作简单，制备效率高。
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| GB/T 7714 | 王晓露 , 朱昭熹 , 郭福 . 银纳米颗粒及采用醌类化合物调控多元醇还原法制备银纳米颗粒的方法 : CN202310020325.5[P]. | 2023-01-06 . |
| MLA | 王晓露 et al. "银纳米颗粒及采用醌类化合物调控多元醇还原法制备银纳米颗粒的方法" : CN202310020325.5. | 2023-01-06 . |
| APA | 王晓露 , 朱昭熹 , 郭福 . 银纳米颗粒及采用醌类化合物调控多元醇还原法制备银纳米颗粒的方法 : CN202310020325.5. | 2023-01-06 . |
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Abstract ：
本发明公开了一种铜球表面化学镀锡的方法，属于材料的制备与连接技术领域。所述铜球表面化学镀锡方法的步骤包括：先利用盐酸乙醇溶液对铜球表面进行酸洗并酸化，然后除去铜球表面的盐酸乙醇溶液，再对铜球表面进行化学镀锡。本发明基于铜球与锡基焊料的结合较差的问题，通过先对铜球表面进行化学镀锡，其关键步骤在于铜球表面的酸洗并酸化，该操作可以改善铜球与锡镀层的结合性能，进一步以锡镀层为过渡，解决了铜球与锡基焊料结合较差的问题。本发明提供的制备方法工艺简单，成本低廉，可制作出镀敷材料厚度可控的镀锡铜球。
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| GB/T 7714 | 汉晶 , 李腾 , 孟洲 et al. 一种铜球表面化学镀锡的方法 : CN202310824346.2[P]. | 2023-07-06 . |
| MLA | 汉晶 et al. "一种铜球表面化学镀锡的方法" : CN202310824346.2. | 2023-07-06 . |
| APA | 汉晶 , 李腾 , 孟洲 , 晋学轮 , 郭福 , 马立民 et al. 一种铜球表面化学镀锡的方法 : CN202310824346.2. | 2023-07-06 . |
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Abstract ：
本实用新型公开一种用于纳米银焊膏热疲劳测试结构，属于功率电子器件封装技术领域，包括基板，基板上方设置有阵列烧结层，阵列烧结层上方设置有芯片，基板与芯片通过阵列烧结层形成互联结构；阵列烧结层由若干个连续设置的纳米银层构成，相邻两纳米银层之间设置有间隙，若干个纳米银层围成正方形结构，且若干个纳米银层沿芯片的边缘设置。本实用新型能够保证互联结构在热疲劳载荷下具有更集中的应力，解决了传统结构在测试热疲劳可靠性高的纳米银焊膏时效果不明显的问题，缩短了测试时间。
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| GB/T 7714 | 马立民 , 陈玉章 , 汉晶 et al. 一种用于纳米银焊膏热疲劳测试结构 : CN202320800760.5[P]. | 2023-04-12 . |
| MLA | 马立民 et al. "一种用于纳米银焊膏热疲劳测试结构" : CN202320800760.5. | 2023-04-12 . |
| APA | 马立民 , 陈玉章 , 汉晶 , 贾强 , 郭福 , 晋学轮 et al. 一种用于纳米银焊膏热疲劳测试结构 : CN202320800760.5. | 2023-04-12 . |
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Abstract ：
本发明涉及属于材料制备与连接技术领域，本发明公开了一种能够控制微小线性焊点尺寸的方法，包括：获取若干个特定结构的铜棒，且铜棒的端面为正方形；对铜棒进行预处理，获取待焊接铜棒，对待焊接铜棒的表面进行处理，获取处理后的铜棒；按照预设的空间位置，固定两个处理后的铜棒，并放置于干燥皿中等待凝固，对凝固后的处理后的铜棒填充焊膏，对处理后的铜棒进行焊接，获取对接焊棒；将对接焊棒固定在PCB板上进行减薄处理，获取减薄处理后的对接焊棒；对接近所需尺寸的所述对接焊棒进行抛磨处理，控制微小线性焊点尺寸。本发明通过特制的焊接载体和打磨平台，保证焊点表面得到充分抛光，使线性焊点尺寸完整、图像清晰的要求。
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| GB/T 7714 | 汉晶 , 李腾 , 晋学轮 et al. 一种能够控制微小线性焊点尺寸的方法 : CN202310831227.X[P]. | 2023-07-07 . |
| MLA | 汉晶 et al. "一种能够控制微小线性焊点尺寸的方法" : CN202310831227.X. | 2023-07-07 . |
| APA | 汉晶 , 李腾 , 晋学轮 , 郭福 , 马立民 , 王乙舒 et al. 一种能够控制微小线性焊点尺寸的方法 : CN202310831227.X. | 2023-07-07 . |
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Abstract ：
本发明公开一种用于纳米银焊膏热疲劳测试结构及其制作方法，属于功率电子器件封装技术领域，包括基板，基板上方设置有阵列烧结层，阵列烧结层上方设置有芯片，基板与芯片通过阵列烧结层形成互联结构；阵列烧结层由若干个连续设置的纳米银层构成，相邻两纳米银层之间设置有间隙，若干个纳米银层围成正方形结构，且若干个纳米银层沿芯片的边缘设置。本发明能够保证互联结构在热疲劳载荷下具有更集中的应力，解决了传统结构在测试热疲劳可靠性高的纳米银焊膏时效果不明显的问题，缩短了测试时间。
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| GB/T 7714 | 马立民 , 陈玉章 , 汉晶 et al. 一种用于纳米银焊膏热疲劳测试结构及其制作方法 : CN202310386215.0[P]. | 2023-04-12 . |
| MLA | 马立民 et al. "一种用于纳米银焊膏热疲劳测试结构及其制作方法" : CN202310386215.0. | 2023-04-12 . |
| APA | 马立民 , 陈玉章 , 汉晶 , 贾强 , 郭福 , 晋学轮 et al. 一种用于纳米银焊膏热疲劳测试结构及其制作方法 : CN202310386215.0. | 2023-04-12 . |
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