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学者姓名：郭福
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摘要 ：
Lightweight carbon fibers with high mechanical performance are referred to as an ideal reinforcement for an extensive variety of composite materials. However, the addition of carbon fibers into electronic interconnection solders is extremely limited so that the expected reinforcement in the mechanical properties of the composite solder joints has not been completely realized. Here, we used magnetic fields to align Ni-coated carbon fibers in the Sn-3.0Ag-0.5Cu solder vertically with the Cu substrate and prepared the oriented composite solder joints. We achieved a further improvement in the shear performance of composite solder joints (similar to 58 MPa) with a small addition of Ni-coated carbon fibers (0.5 wt%), which is 25% higher than that of pristine joints. It is found that these vertically oriented carbon fibers changed the propagation path of shear cracks and thus increased the shear resistance. Ni-coated carbon fibers also promoted nucleation of interfacial Cu6Sn5 in the solder joints during reflow, but prevented the formation of brittle Cu3Sn phase during isothermal aging, thus ensuring the high shear strength of composite solder joints after isothermal aging. This success provides a new pathway to fabricate a strong composite solder joint with a limited addition of reinforcements by aligning their orientation.
关键词 ：
Composite solders Composite solders Ni-coated short carbon fibers Ni-coated short carbon fibers Magnetic alignment Magnetic alignment Shear strength Shear strength
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| GB/T 7714 | Liu, Aiwei , Ji, Xiaoliang , Du, Yihui et al. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field [J]. | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 326 . |
| MLA | Liu, Aiwei et al. "Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field" . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 326 (2024) . |
| APA | Liu, Aiwei , Ji, Xiaoliang , Du, Yihui , Wang, Yishu , Wu, Yufeng , Guo, Fu . Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field . | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY , 2024 , 326 . |
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摘要 ：
Currently, three-dimensional packaging (3D packaging) is used as the most feasible technological way to break Moore's law. In 3D packaging, three different sizes of solder joints must work together to achieve highly integrated vertical interconnects. This architecture needs to be realized by multiple reflow in industrial production. Therefore, it is necessary to choose three solders with different melting points. In order to further extend the reflow temperature range and increase the flexibility of 3D integration, the development of low melting point solders is required.SnBi solder joints often suffer from brittle fracture due to the inherent brittleness of Bi, and SnIn solder joints is limited in its low tensile strength. Therefore, a series of SnBiIn alloys with different ratios were prepared. During the composition design, orthogonal experimental method was used to determine composition ratios. The effects of different composition on the micro-morphology as well as the mechanical properties of SnBiIn alloys were investigated. Samples were prepared using a vacuum induction furnace and the microstructure of the samples was analyzed. The mechanical properties of the alloys with different compositions were measured by tensile test. The results of this study provide a research basis for the design of low melting point solder.
关键词 ：
Low melting point Low melting point Sn-Bi-In alloy Sn-Bi-In alloy mechanical properties mechanical properties microstructure microstructure Composition design Composition design
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| GB/T 7714 | Wang, Xuechi , Ji, Xiaoliang , Wang, Yishu et al. Study of multi principal element solders with low melting point for 3D electronic packaging [J]. | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
| MLA | Wang, Xuechi et al. "Study of multi principal element solders with low melting point for 3D electronic packaging" . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2024) . |
| APA | Wang, Xuechi , Ji, Xiaoliang , Wang, Yishu , Guo, Fu , Yuan, Hao , Qi, Yu . Study of multi principal element solders with low melting point for 3D electronic packaging . | 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT , 2024 . |
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摘要 ：
Integrated circuit systems are always suffering the temperature cycling environment caused by frequent power on and off. Mismatch in thermal expansion coefficients among chip package components will cause severe cyclic stress to the solder joints. During thermal fatigue, ll-Sn grains tended to generate thermal fatigue cracks at the grain boundaries. This work proposed a strategy of using amorphous Co-15 at.% P coating as the interface layer to inhibit the initiation and propagation of thermal fatigue cracks and improve the shear strength of solder joints by numerous endogenous CoSn3 laths. Mechanistically, based on the amorphous structure of the Co-P coating, Co atoms would massively and rapidly diffuse into the molten solder during the liquid-solid diffusion stage of reflow soldering, and the eutectic solidification together with ll-Sn spontaneously precipitated numerous laths of CoSn3 intermetallic compounds (IMC), which were evenly distributed and became the skeleton of the solders. The skeleton-like CoSn3 laths with high elastic modulus were the reinforcing phase of Sn-based solder, but also refined the grains of ll-Sn. The refinement of ll-Sn grains and the strengthening of CoSn3 laths played an important role in inhibiting the initiation and propagation of thermal fatigue cracks. In addition, a discontinuous Co-Sn IMC layer was formed between the amorphous Co-P and the solder. The alternating appearance of CoSn3 and relatively soft ll-Sn at the interface avoided the generation of cracks at the interface during temperature cycling.
关键词 ：
Diffusion Diffusion Co -P coatings Co -P coatings Thermal fatigue Thermal fatigue Temperature cycling Temperature cycling Intermetallic compounds Intermetallic compounds Solder joints Solder joints
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| GB/T 7714 | Liu, Shuang , Ma, Limin , Geng, Zelin et al. A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths [J]. | MATERIALS CHARACTERIZATION , 2024 , 209 . |
| MLA | Liu, Shuang et al. "A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths" . | MATERIALS CHARACTERIZATION 209 (2024) . |
| APA | Liu, Shuang , Ma, Limin , Geng, Zelin , Wang, Yuwei , Zhen, Cheng , Li, Dan et al. A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths . | MATERIALS CHARACTERIZATION , 2024 , 209 . |
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摘要 ：
This study investigates the structural, mechanical, and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading by performing first-principles calculations based on density functional theory. The parameters of the lattice a and c were found to depend on the Al-Si and the Sc-Si bonds, respectively. Tensile stress-strain curves were used to obtain ideal tensile strengths of 16.1 GPa and 21.2 GPa along the a-and c-axes, respectively. The criteria for stability showed that the AlSi2Sc2 compound became mechanically unstable when the strain exceeded 0.1 and 0.3 along the a- and the c-axes, respectively. The polycrystalline elastic constants of AlSi2Sc2 decreased with increasing strain along both axes as well, as did its Debye temperature and minimum thermal conductivity. An analysis of its electronic structure indicated that the Al-Si bonds mainly originated from the hybridization of the Al-3p and the Si-3p states, whereas the Sc-Si bonds originated from the Sc-3d and Si-3p states.
关键词 ：
Electronic structure Electronic structure Mechanical properties Mechanical properties Uniaxial tensile Uniaxial tensile Thermodynamic behavior Thermodynamic behavior First principles First principles
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| GB/T 7714 | Tan, Yong , Ma, Limin , Wang, Yishu et al. Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study [J]. | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS , 2023 , 174 . |
| MLA | Tan, Yong et al. "Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study" . | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS 174 (2023) . |
| APA | Tan, Yong , Ma, Limin , Wang, Yishu , Zhou, Wei , Wang, Xiaolu , Guo, Fu . Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study . | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS , 2023 , 174 . |
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摘要 ：
本发明公开了一种纳米纤维取向可控的纤维素薄膜及其制备方法，该纳米纤维取向可控的纤维素薄膜的制备具体为：首先，将Tempo法制备的纤维素纳米纤维制备成纤维素纳米纤维悬浮液，然后采用挤出式打印的方式将纤维素纳米纤维悬浮液挤出至聚对苯二甲酸乙二醇酯(PET)膜上，然后，将其置于常温常压下干燥，剥离，得到纤维素薄膜。打印过程中，纤维素纳米纤维在剪切力作用下发生纤维定向排列，使得到的纤维素薄膜具有高力学强度、高结晶度、高透明度。与现有技术相比，本发明制备的纳米纤维取向可控的纤维素薄膜中纳米纤维分散均匀、排列可控，极大的缩短了纤维素薄膜制备工艺流程时间，同时，纳米纤维取向可控的纤维素薄膜具有生物相容性，较好的透明度和机械性能等优点，可进行产业化发展。
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| GB/T 7714 | 李丹 , 杨云霞 , 郭福 . 一种纳米纤维取向可控的纤维素薄膜及其制备方法 : CN202310894639.8[P]. | 2023-07-20 . |
| MLA | 李丹 et al. "一种纳米纤维取向可控的纤维素薄膜及其制备方法" : CN202310894639.8. | 2023-07-20 . |
| APA | 李丹 , 杨云霞 , 郭福 . 一种纳米纤维取向可控的纤维素薄膜及其制备方法 : CN202310894639.8. | 2023-07-20 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
本发明属于半导体技术领域，具体涉及一种复合多层金属基板及其制备方法、一种功率半导体器件。包括以下步骤：在反应腔内固定好靶材和基板，并加热基板；开启第一激光器轰击第一贵金属靶材，在基板上沉积第一贵金属薄膜；第一激光器停止工作，开启第二激光器轰击第二贵金属靶材，在第一贵金属薄膜上沉积第二贵金属薄膜；使第一脉冲激光的轰击靶材转换为第一自蔓延金属靶材，第二脉冲激光的轰击靶材转换为第二自蔓延金属靶材；交替使第一激光器和第二激光器工作，形成自蔓延金属薄膜，即得。该方法制备所得金属基板，既具有抗氧化效果，也具有焊料的连接作用，可以实现与芯片的直接贴装，提高功率器件制备效率，同时避免化学污染和有机物残存。
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| GB/T 7714 | 贾强 , 周博龙 , 郭福 et al. 一种复合多层金属基板及其制备方法、一种功率半导体器件 : CN202310054856.6[P]. | 2023-02-03 . |
| MLA | 贾强 et al. "一种复合多层金属基板及其制备方法、一种功率半导体器件" : CN202310054856.6. | 2023-02-03 . |
| APA | 贾强 , 周博龙 , 郭福 , 王乙舒 , 马立民 . 一种复合多层金属基板及其制备方法、一种功率半导体器件 : CN202310054856.6. | 2023-02-03 . |
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摘要 ：
本发明涉及电子封装材料连接技术领域，特别是涉及一种增强Sn基无铅焊料稳定性的方法。方法包括以下步骤：步骤1，向Sn基无铅焊料焊膏中掺加镀镍碳纤维，得到Sn基复合焊料；步骤2，在焊接过程中通过外加磁场的方式使熔融态的Sn基复合焊料中的镀镍碳纤维定向排布，通过调控镀镍碳纤维排布取向增强Sn基无铅焊料稳定性。镀镍碳纤维的镀Ni层具有铁磁性，本发明中通过在外加磁场的作用下，根据磁场取向不同而形成镀镍碳纤维的定向排布。当磁场取向与基板成一定夹角时，Sn基复合焊料中的镀镍碳纤维便可对焊点起到力学支撑作用。因此，可以在减少镀镍碳纤维掺量的同时，实现焊点性能的增强。
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| GB/T 7714 | 郭福 , 刘爱炜 , 杜逸晖 et al. 一种增强Sn基无铅焊料稳定性的方法 : CN202310270607.0[P]. | 2023-03-20 . |
| MLA | 郭福 et al. "一种增强Sn基无铅焊料稳定性的方法" : CN202310270607.0. | 2023-03-20 . |
| APA | 郭福 , 刘爱炜 , 杜逸晖 , 王乙舒 , 籍晓亮 , 马立民 et al. 一种增强Sn基无铅焊料稳定性的方法 : CN202310270607.0. | 2023-03-20 . |
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摘要 ：
In this research, camphorquinone (CQ)-mediated one-pot polyol methods to synthesize silver right bipyramids and nanorods with high yields are developed. The key strategy of these methods is the use of CQ which is first applied to selectively stabilize Ag(100) facets through capping. As CQ stabilizes small-sized nanocrystals, including single-twinned and nanorod struc-tures, we successfully synthesized silver right bipyramids and nanorods as the two dominant products in a CQ-mediated polyol system. Further morphology control between silver nanorods and silver right bipyramids is conducted through adjusting the poly(vinylpyrrolidone) (PVP) concentration and reaction temper-ature, which can improve the formation of single-twinned and fivefold twinned particles through affecting the reduction kinetics. Silver nanorods with a yield of 87% are obtained under 150 degrees C with a PVP/CQ/AgNO3 molar ratio of 1.2:2:1, while silver right bipyramids with a yield of 88% are obtained under 120 degrees C with a molar ratio of 1.6:2:1.
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| GB/T 7714 | Zhu, Zhaoxi , Wang, Xiaolu , Yu, Haiyang et al. Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods [J]. | CRYSTAL GROWTH & DESIGN , 2023 , 23 (3) : 1455-1465 . |
| MLA | Zhu, Zhaoxi et al. "Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods" . | CRYSTAL GROWTH & DESIGN 23 . 3 (2023) : 1455-1465 . |
| APA | Zhu, Zhaoxi , Wang, Xiaolu , Yu, Haiyang , Zhou, Wei , Wang, Yishu , Han, Jing et al. Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods . | CRYSTAL GROWTH & DESIGN , 2023 , 23 (3) , 1455-1465 . |
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摘要 ：
本发明公开了一种金属陶瓷涂层及其制备方法，该金属陶瓷涂层是采用激光熔融方法将混合粉体熔覆在基体上得到的，以所述混合粉体的总重量为100％计，所述混合粉体包括60.0％‑67.7％的Ni、20.5‑22.5wt％的Cr、3.2‑4.0wt％的Nb、8.1‑9.5wt％的Mo和0.5‑1.5wt％的Al2O3。本发明金属陶瓷涂层具有良好的耐高温性、抗氧化性、耐腐蚀性、可加工性能，同时金属陶瓷涂层具备耐水蒸气腐蚀性能以及较高的涂层强度。
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| GB/T 7714 | 吴玉锋 , 吴旭明 , 王朝辉 et al. 一种金属陶瓷涂层及其制备方法 : CN202310937891.2[P]. | 2023-07-28 . |
| MLA | 吴玉锋 et al. "一种金属陶瓷涂层及其制备方法" : CN202310937891.2. | 2023-07-28 . |
| APA | 吴玉锋 , 吴旭明 , 王朝辉 , 郭福 , 李彬 , 李林聪 . 一种金属陶瓷涂层及其制备方法 : CN202310937891.2. | 2023-07-28 . |
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摘要 ：
本发明公开了一种新型低熔点VC均热板用铜基钎料焊膏，涉及材料制备与连接领域，该焊膏中的铜基钎料成分质量占比为Cu67.5～67.9％，Sn22.6～23.0％，Ni3.7～3.9％，P5.6～5.8％，本发明利用金属锡对PH600铜基钎料进行成分调整，在保证使用性能良好的前提下，使得焊膏的熔点相对较低，同时克服了铜基钎料作为硬钎料熔点高且容易氧化的缺陷，具有节约能源、降低成本的优点。
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| GB/T 7714 | 郭福 , 吕伊铭 , 汉晶 et al. 一种新型低熔点VC均热板用铜基钎料焊膏 : CN202310227613.8[P]. | 2023-03-10 . |
| MLA | 郭福 et al. "一种新型低熔点VC均热板用铜基钎料焊膏" : CN202310227613.8. | 2023-03-10 . |
| APA | 郭福 , 吕伊铭 , 汉晶 , 马立民 , 晋学轮 , 李腾 et al. 一种新型低熔点VC均热板用铜基钎料焊膏 : CN202310227613.8. | 2023-03-10 . |
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