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学者姓名：李晓延
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摘要 ：
The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420 & DEG;C. It was motivated by potential applications of Cu-Sn intermetallic compounds (IMCs) solder joint in third-generation wide bandgap semiconductor devices. Experimental results revealed that the Cu41Sn11 phase was unstable under high-temperature conditions, the full Cu41Sn11 joint transformed into the full & alpha;(Cu) joint (Cu/& alpha;(Cu)/Cu) joint at 150 h during thermal aging. The formed & alpha;(Cu) phase was a Cu solid solution with inhomogeneous Sn atomic concentration, and its crystal structure and orientation were consistent with the original Cu plate. The conversion of the Cu41Sn11 to & alpha;(Cu) was accompanied by the formation of voids due to the volume shrinkage effect, predominantly near the middle of the solder joint interface. The & alpha;(Cu) solder joint presented a decrease in strength but an increase in strain rate sensitivity index compared to the Cu41Sn11 solder joint. Furthermore, the strain rate sensitivity index of & alpha;(Cu) and Cu41Sn11 is lower than that of ordinary Sn solders. After the shear test, the fractures that occurred in Cu41Sn11 grains were brittle, while the fractures in & alpha;(Cu) grains were ductile.
关键词 ：
solder joint solder joint shear strength shear strength aging aging microstructure evolution microstructure evolution fracture fracture
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| GB/T 7714 | Yang, Gangli , Li, Xiaoyan , Han, Xu et al. Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging [J]. | JOURNAL OF ELECTRONIC PACKAGING , 2023 , 145 (3) . |
| MLA | Yang, Gangli et al. "Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging" . | JOURNAL OF ELECTRONIC PACKAGING 145 . 3 (2023) . |
| APA | Yang, Gangli , Li, Xiaoyan , Han, Xu , Zhang, Hu , Wen, Linjie , Li, Shanshan . Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging . | JOURNAL OF ELECTRONIC PACKAGING , 2023 , 145 (3) . |
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摘要 ：
Herein, it was investigated the growth kinetics, grain orientation, and mechanical properties of the Cu20Sn6 phase aged from full Cu3Sn joints at the aging temperatures of 600, 620, and 640 degrees C. The results showed that the growth mechanism of the Cu20Sn6 phase was dominated by bulk diffusion. Furthermore, the activation energy of Q and the growth rate constant of k(0) were respectively 45.25 kJ/mol and 3.6 x 10(4) mu m(2)/min for the Cu20Sn6 phase. Besides, although the preferred orientation of the Cu20Sn6 was not very obvious, it was [0001] direction in parallel to the diffusion direction. And, in ND, the [010](Cu3Sn) was parallel to the [01-11](Cu20Sn6) and [11-21](Cu20Sn6). Based on the nanoindentation results, the average hardness of Cu3Sn and Cu20Sn6 phase was approximately 7.12 +/- 0.12 GPa and 8.69 +/- 0.47 GPa, while the corresponding Young's moduli were 143.80 +/- 4.51 GPa and 166.43 +/- 7.32 GPa. Consequently, the Cu20Sn6 phase had a better performance on hardness and Young's moduli than Cu3Sn. Last but not least, the shearing strength for the soldering joints increased from 35.71 to 60.77 MPa with increasing aging time. The fracture mechanism of Cu3Sn was an intergranular fracture, while it was a cleavage fracture for Cu20Sn6. Furthermore, the fracture mechanism presented a mixed fracture of intergranular and transgranular fracture when the joints consisted of Cu3Sn and Cu20Sn6.
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| GB/T 7714 | Zhang, Hu , Zhou, Wei , Ji, Xiaoliang et al. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2023 , 34 (16) . |
| MLA | Zhang, Hu et al. "Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 34 . 16 (2023) . |
| APA | Zhang, Hu , Zhou, Wei , Ji, Xiaoliang , Li, Xiaoyan . Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2023 , 34 (16) . |
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摘要 ：
In this study, Cu/Sn/Cu structure under a pressure of 1.5 N was soldered at 390-450 degrees C. Then, microstructure evolution and changes in mechanical properties of solder joint during the formation of full Cu41Sn11 joint were systematically analyzed. Experimental results showed that Cu6Sn5 and Cu3Sn were observed in the interfacial region at 420 C in the early stage of soldering. The Cu/Sn/Cu structure completely transformed into Cu/Cu3Sn/ Cu at 1 h. With the further progress of the interfacial reaction, Cu41Sn11 appeared and grew at the expense of Cu3Sn. Eventually, the full Cu41Sn11 joint was formed at 10 h. The growth of Cu41Sn11 was controlled by volume-diffusion. Moreover, diffusion activation energy of Cu41Sn11 was about 108.19 kJ/mol. The shear strength of full Cu3Sn joints was 45 MPa, while that of the solder joints with 25, 50, 75 and 100% Cu41Sn11 was 50, 52.2, 59 and 64.5 MPa, respectively. For full Cu3Sn and full Cu41Sn11 joints, respectively, the fracture occurred partly within intermetallic compounds (IMCs) layers and partly along the Cu/IMC interface. However, for the joints composed of Cu3Sn and Cu41Sn11, all fractures occurred in the IMCs layer. Besides, all IMCs joints were brittle fracture, and the fracture of Cu3Sn was mainly intergranular, while the fracture that occurred in Cu41Sn11 was mainly transgranular.
关键词 ：
Growth kinetic Growth kinetic Cu41Sn11 Cu41Sn11 Mechanical property changes Mechanical property changes Brittle failure Brittle failure Microstructure evolution Microstructure evolution
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| GB/T 7714 | Yang, Gangli , Li, Xiaoyan , Han, Xu et al. Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging [J]. | MICROELECTRONICS RELIABILITY , 2022 , 130 . |
| MLA | Yang, Gangli et al. "Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging" . | MICROELECTRONICS RELIABILITY 130 (2022) . |
| APA | Yang, Gangli , Li, Xiaoyan , Han, Xu , Zhang, Hu , Wen, Linjie , Li, Shanshan . Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging . | MICROELECTRONICS RELIABILITY , 2022 , 130 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
The laser-welded 2A97-T3 aluminum-lithium (Al-Li) alloy joints were sampled from upper horizontal surface, transverse section, longitudinal section, and lower horizontal surface to develop the comprehensive and spatial understandings for microstructure and microtexture evolution. Various characterization methods in terms of electron backscattered diffraction such as orientation imaging microscopy, pole figure, inverse pole figure, misorientation angles distribution, orientation distribution function, and numerical simulation were used. The results show obvious differences in the grain morphology, orientation, and microtexture in different areas of the joint, due to the nonequilibrium characteristic of cold rolling and laser beam welding. The laser beam can induce the formation and growth of dynamic recrystallization and sub-structure grains in the heat affected zone. Moreover, the original microtexture characteristics of the base metal is weakened and thus eliminated in both the heat affected zone and the weld zone.
关键词 ：
microtexture microtexture electron backscattered diffraction electron backscattered diffraction laser beam welding laser beam welding microstructure microstructure Al-Li alloy Al-Li alloy
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| GB/T 7714 | Shao Yingkai , Li Xiaoyan , Chen Li et al. Investigation on Microstructure and Microtexture of LaserWelded 2A97-T3 Al-Li Alloys by EBSD [J]. | RARE METAL MATERIALS AND ENGINEERING , 2022 , 51 (12) : 4464-4474 . |
| MLA | Shao Yingkai et al. "Investigation on Microstructure and Microtexture of LaserWelded 2A97-T3 Al-Li Alloys by EBSD" . | RARE METAL MATERIALS AND ENGINEERING 51 . 12 (2022) : 4464-4474 . |
| APA | Shao Yingkai , Li Xiaoyan , Chen Li , Ji Gang . Investigation on Microstructure and Microtexture of LaserWelded 2A97-T3 Al-Li Alloys by EBSD . | RARE METAL MATERIALS AND ENGINEERING , 2022 , 51 (12) , 4464-4474 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
In the present study, the intermetallic compound (IMC) joints consisting of Cu3Sn were aged at high temperatures of 540, 560, and 580 ? to form a sole phase of Cu41Sn11 in a short time period. The variations in morphology, growth kinetics, and grain orientation for the Cu41Sn11 phase originating from the Cu3Sn during the high temperature conditions were systematically investigated. The original Cu3Sn phase appeared as slender grains, while the final phase, which contained Cu41Sn11 grains, was displayed as coarse columnar grains. The growth kinetics for the Cu41Sn11 phase during the 540, 560, and 580 ? temperature testing periods were roughly controlled by the grain boundary diffusion and more precisely controlled by the activation energy, which was 72.86 kJ/mol. The growth rate constant of k(0) was 2.5*10<^>(7) mu m(3)/min. The original Cu3Sn phase exhibited two preferred orientations of [100] and [203], while the Cu41Sn11 phase did not exhibit the apparent grain orientation. Various temperatures had specific effects on the kinetics and the orientation: The newly formed Cu41Sn11 grains were used to maintain the coherent or semi-coherent interface ((111)(F)//(100)(P) and [101](F)//[010](P)) and reduce the interfacial energy, which resulted in the step-growth mechanism during the early stage noted at 540 ? (lower temperature); by contrast, non-coherent interface between Cu3Sn and Cu41Sn11 was formed during the higher temperature (580 ?), which also resulted in the formation of more small-size cores with large amounts of grain boundaries without apparent orientation; their mechanism of growth was controlled by the grain boundary diffusion.
关键词 ：
Intermetallic compounds Intermetallic compounds Growth kinetics Growth kinetics Temperature effects Temperature effects Grain orientation Grain orientation
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| GB/T 7714 | Zhang, Hu , Li, Xiaoyan , Zhou, Wei . High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process [J]. | MATERIALS CHEMISTRY AND PHYSICS , 2022 , 290 . |
| MLA | Zhang, Hu et al. "High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process" . | MATERIALS CHEMISTRY AND PHYSICS 290 (2022) . |
| APA | Zhang, Hu , Li, Xiaoyan , Zhou, Wei . High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process . | MATERIALS CHEMISTRY AND PHYSICS , 2022 , 290 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
2A97 is the third-generation aluminum-lithium (Al-Li) alloy developed by China. However, the fine equiaxed zone (FEQZ) of weld is the weakest area of its joint, which severely limits its practical application in the aerospace field. In this study, the macro- and microscopic characteristics of weld and the formation mechanism of the microstructure under the condition of non-autogenous laser welding (NLW) were investigated. The results showed that the droplet transition behavior varied with the change in the content of low-boiling-temperature elements of filler metals. The porosity imperfection in 2A97-T3 via NLW was relatively serious, which could be modified by using ER2319 filler metal. The addition of Zr in the equiaxed zone resulted in effective refinement of the equiaxed dendrite. Furthermore, it also led to the alternate distribution of coarse and fine equiaxed dendrites. The distribution of FEQZ was affected by the flow of the weld pool and concentrated at the four corners of the weld. Moreover, its morphology and distribution ranges were influenced significantly by the welding parameters and filler metals.
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| GB/T 7714 | Shao, Yingkai , Li, Xiaoyan , Chen, Li et al. Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy [J]. | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) : 1413-1423 . |
| MLA | Shao, Yingkai et al. "Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy" . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE 52 . 3 (2021) : 1413-1423 . |
| APA | Shao, Yingkai , Li, Xiaoyan , Chen, Li , He, Enguang . Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) , 1413-1423 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
Purpose This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures. Design/methodology/approach To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer. Findings The generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260 degrees C and 290 degrees C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320 degrees C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260 degrees C, 290 degrees C and 320 degrees C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260 degrees C and 290 degrees C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320 degrees C. Originality/value The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.
关键词 ：
Growth kinetics Growth kinetics Activation energy Activation energy Mechanism Mechanism Ultrasounds Ultrasounds Intermetallic compounds Intermetallic compounds
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 34 (2) : 79-87 . |
| MLA | Han, Xu et al. "Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 34 . 2 (2021) : 79-87 . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 34 (2) , 79-87 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid-liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 mu m. Findings Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s. Originality/value The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.
关键词 ：
Interface Interface Microstructure Microstructure Ultrasound Ultrasound IMCs IMCs Soldering time Soldering time
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng et al. Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) : 206-214 . |
| MLA | Han, Xu et al. "Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 33 . 4 (2021) : 206-214 . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng , Chen, Dalong . Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) , 206-214 . |
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摘要 ：
Full intermetallics (IMCs) solder joints are of great significance to electronic packaging technology. In this paper, some efforts have been made for bridging research gap on reliabilities of such joints. Shear fracture of different strain rates, for Cu/Cu3Sn/Cu joints derived from Cu-15 mu m Sn-Cu sandwich structure, was comprehensively analyzed. With the strain rates of 6.67 x 10(-2) s(-1), 6.67 x 10(-1) s(-1) , and 6.67 s(-1), the shear strength of Cu/Cu3Sn/Cu joints was, respectively, 44 MPa, 48.4 MPa, and 57.6 MPa, which presented an ascending trend. The increased strength of joints was attributed to the intensification of work-hardening effect within interfacial region. For the strain rates of 6.67 x 10(-2) s(-1) and 6.67 x 10(-1) s(-1), the fracture of joints was both a mixture of transgranular fracture and intergranular fracture within Cu3Sn, while the fractured path both had no diversion and kept continuous. For the strain rate of 6.67 s(-1), only transgranular fracture occurred within Cu3Sn, and the fractured path diverted with the appearance of step. The transgranular fracture at these three strain rates all belonged to cleavage fracture, and their proportion presented the increasing trend of 25.5% -> 59.5% -> 100% (Strain rates: 6.67 x 10(-2) s(-1) -> 6.67 x 10(-1) s(-1) -> 6.67 s(-1)). Because of the fracture mechanism of different strain rates, the crack propagation resistance increased by a larger extent for 6.67 x 10(-1) s(-1) -> 6.67 s(-1) in comparison with that for 6.67 x 10(-2) s(-1) -> 6.67 x 10(-1) s(-1). Moreover, the strain rate sensitivity of Cu/Cu3Sn/Cu joints was smaller than that of conventional joints, which was due to the different interfacial structure of two joints.
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| GB/T 7714 | Yao, Peng , Li, Xiaoyan . Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2020 , 31 (4) : 2862-2876 . |
| MLA | Yao, Peng et al. "Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 31 . 4 (2020) : 2862-2876 . |
| APA | Yao, Peng , Li, Xiaoyan . Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2020 , 31 (4) , 2862-2876 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
Correlation between the ultimate tensile strength and the hardness of aluminum alloy 2219 and its joints welded with a variable-polarity tungsten electrode in inert gases (VPTIG) and by friction stir welding (FSW) is studied. The yield strength (sigma(y)) and the ultimate strength (sigma(r)) of the base metal, the microhardness and the strain hardening coefficient of the welded joints are determined. Linear correlation dependences are suggested for the yield strength, the ultimate strength, and the hardness. The strain hardening coefficient and the ratio sigma(y)/sigma(r)are shown to be correlated. The correlations are based on the measurement of microhardness and can be used for predicting the strength of fusion zones and heat-affected zones of aluminum alloys joined by a narrow weld.
关键词 ：
aluminum alloy 2219 aluminum alloy 2219 yield strength yield strength welding with variable-polarity tungsten electrode in inert gases welding with variable-polarity tungsten electrode in inert gases friction stir welding friction stir welding microhardness microhardness
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| GB/T 7714 | Li, Mian , Li, Xiaoyan , Li, Hui et al. A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints [J]. | METAL SCIENCE AND HEAT TREATMENT , 2020 , 62 (3-4) : 199-204 . |
| MLA | Li, Mian et al. "A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints" . | METAL SCIENCE AND HEAT TREATMENT 62 . 3-4 (2020) : 199-204 . |
| APA | Li, Mian , Li, Xiaoyan , Li, Hui , Niu, Lanqiang . A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints . | METAL SCIENCE AND HEAT TREATMENT , 2020 , 62 (3-4) , 199-204 . |
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