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学者姓名：李晓延
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摘要 ：
2A97 is the third-generation aluminum-lithium (Al-Li) alloy developed by China. However, the fine equiaxed zone (FEQZ) of weld is the weakest area of its joint, which severely limits its practical application in the aerospace field. In this study, the macro- and microscopic characteristics of weld and the formation mechanism of the microstructure under the condition of non-autogenous laser welding (NLW) were investigated. The results showed that the droplet transition behavior varied with the change in the content of low-boiling-temperature elements of filler metals. The porosity imperfection in 2A97-T3 via NLW was relatively serious, which could be modified by using ER2319 filler metal. The addition of Zr in the equiaxed zone resulted in effective refinement of the equiaxed dendrite. Furthermore, it also led to the alternate distribution of coarse and fine equiaxed dendrites. The distribution of FEQZ was affected by the flow of the weld pool and concentrated at the four corners of the weld. Moreover, its morphology and distribution ranges were influenced significantly by the welding parameters and filler metals.
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| GB/T 7714 | Shao, Yingkai , Li, Xiaoyan , Chen, Li et al. Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy [J]. | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) : 1413-1423 . |
| MLA | Shao, Yingkai et al. "Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy" . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE 52 . 3 (2021) : 1413-1423 . |
| APA | Shao, Yingkai , Li, Xiaoyan , Chen, Li , He, Enguang . Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) , 1413-1423 . |
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摘要 ：
Purpose This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures. Design/methodology/approach To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer. Findings The generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260 degrees C and 290 degrees C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320 degrees C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260 degrees C, 290 degrees C and 320 degrees C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260 degrees C and 290 degrees C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320 degrees C. Originality/value The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.
关键词 ：
Activation energy Activation energy Growth kinetics Growth kinetics Intermetallic compounds Intermetallic compounds Mechanism Mechanism Ultrasounds Ultrasounds
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 . |
| MLA | Han, Xu et al. "Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process" . | SOLDERING & SURFACE MOUNT TECHNOLOGY (2021) . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 . |
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摘要 ：
Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid-liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 mu m. Findings Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s. Originality/value The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.
关键词 ：
IMCs IMCs Interface Interface Microstructure Microstructure Soldering time Soldering time Ultrasound Ultrasound
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng et al. Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) : 206-214 . |
| MLA | Han, Xu et al. "Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 33 . 4 (2021) : 206-214 . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng , Chen, Dalong . Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) , 206-214 . |
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摘要 ：
Generally, the failure of solder joint in electronic products may cause the entire product to be scrapped. In this case, the recycling of electronic components is of great significance for saving resources. It is worth pointing out that the effective reuse of electronic components rely on perfect separation of welding interface of them. Aiming at paving the way for developing a feasible interface separation technique theoretically, mole-cular dynamics simulation was carried out to study the effects of electric field direction and strength on the diffusion behavior of atoms at Cu/Cu3Sn interface. It was found that the direction of the electric field played a critical role in affecting the diffusion behavior of the atoms at Cu/Cu3Sn interface. Under the same conditions, the diffusion of atoms were more likely to occur in the models under a positive electric field than that in the one without electric field. Furthermore, study on the diffusion behavior of atoms at Cu/Cu3Sn interface under electric fields of diverse intensities were conducted. As could be seen from the results, the increase of electric field intensities contributed to raising the intrinsic diffusion coefficient of Cu3Sn atoms near the interface, while lowering the intrinsic diffusion coefficient of atoms in Cu crystal, so as to enlarge the difference in diffusion coefficient of interface atoms. Consequently, more obvious Kirkendall effect would be produced, which was beneficial to the separation of Cu/Cu3Sn interface. © 2020, Materials Review Magazine. All right reserved.
关键词 ：
Atoms Atoms Binary alloys Binary alloys Copper alloys Copper alloys Diffusion Diffusion Electric fields Electric fields Molecular dynamics Molecular dynamics Network components Network components Separation Separation Tin alloys Tin alloys
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| GB/T 7714 | Guo, Liting , Li, Xiaoyan , Yao, Peng et al. Molecular Dynamics Simulation of Diffusion Behavior of Atoms at the Interface of Cu/Cu3Sn Under Electric Field [J]. | Materials Reports , 2020 , 34 (1) : 02137-02141 . |
| MLA | Guo, Liting et al. "Molecular Dynamics Simulation of Diffusion Behavior of Atoms at the Interface of Cu/Cu3Sn Under Electric Field" . | Materials Reports 34 . 1 (2020) : 02137-02141 . |
| APA | Guo, Liting , Li, Xiaoyan , Yao, Peng , Li, Yang . Molecular Dynamics Simulation of Diffusion Behavior of Atoms at the Interface of Cu/Cu3Sn Under Electric Field . | Materials Reports , 2020 , 34 (1) , 02137-02141 . |
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摘要 ：
Full intermetallics (IMCs) solder joints are of great significance to electronic packaging technology. In this paper, some efforts have been made for bridging research gap on reliabilities of such joints. Shear fracture of different strain rates, for Cu/Cu3Sn/Cu joints derived from Cu-15 mu m Sn-Cu sandwich structure, was comprehensively analyzed. With the strain rates of 6.67 x 10(-2) s(-1), 6.67 x 10(-1) s(-1) , and 6.67 s(-1), the shear strength of Cu/Cu3Sn/Cu joints was, respectively, 44 MPa, 48.4 MPa, and 57.6 MPa, which presented an ascending trend. The increased strength of joints was attributed to the intensification of work-hardening effect within interfacial region. For the strain rates of 6.67 x 10(-2) s(-1) and 6.67 x 10(-1) s(-1), the fracture of joints was both a mixture of transgranular fracture and intergranular fracture within Cu3Sn, while the fractured path both had no diversion and kept continuous. For the strain rate of 6.67 s(-1), only transgranular fracture occurred within Cu3Sn, and the fractured path diverted with the appearance of step. The transgranular fracture at these three strain rates all belonged to cleavage fracture, and their proportion presented the increasing trend of 25.5% -> 59.5% -> 100% (Strain rates: 6.67 x 10(-2) s(-1) -> 6.67 x 10(-1) s(-1) -> 6.67 s(-1)). Because of the fracture mechanism of different strain rates, the crack propagation resistance increased by a larger extent for 6.67 x 10(-1) s(-1) -> 6.67 s(-1) in comparison with that for 6.67 x 10(-2) s(-1) -> 6.67 x 10(-1) s(-1). Moreover, the strain rate sensitivity of Cu/Cu3Sn/Cu joints was smaller than that of conventional joints, which was due to the different interfacial structure of two joints.
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| GB/T 7714 | Yao, Peng , Li, Xiaoyan . Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2020 , 31 (4) : 2862-2876 . |
| MLA | Yao, Peng et al. "Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 31 . 4 (2020) : 2862-2876 . |
| APA | Yao, Peng , Li, Xiaoyan . Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu-15 mu m Sn-Cu sandwich structure . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2020 , 31 (4) , 2862-2876 . |
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摘要 ：
Phase transformation is an important deformation and blunting mechanism at the crack tip of body-centered cubic (BCC) metals. The BCC-to-face-centered orthogonal (FCO) transformation was only predicted by ab initio calculations. In this paper, the deformation behavior of the nano-sized single-crystalline Mo is in situ investigated in a high-resolution transmission electron microscope at room temperature. We uncover the strain-induced BCC-to-FCO phase transformation. The FCO Mo grows in a layer-by-layer fashion. It is a metastable phase after stress releasing, as confirmed by our ab initio calculation. The BCC-to-FCO phase transformation is realized via lattice shearing and shuffling. IMPACT STATEMENT This paper provides direct in situ atomic-scale evidence of BCC-FCO phase transformation, which has never reported on the experimental level.
关键词 ：
body-centered cubic metals body-centered cubic metals deformation mechanism deformation mechanism In situ TEM In situ TEM phase transformation phase transformation
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| GB/T 7714 | Lu, Yan , Sun, Shiduo , Zeng, Yongpan et al. Atomistic mechanism of nucleation and growth of a face-centered orthogonal phase in small-sized single-crystalline Mo [J]. | MATERIALS RESEARCH LETTERS , 2020 , 8 (9) : 348-355 . |
| MLA | Lu, Yan et al. "Atomistic mechanism of nucleation and growth of a face-centered orthogonal phase in small-sized single-crystalline Mo" . | MATERIALS RESEARCH LETTERS 8 . 9 (2020) : 348-355 . |
| APA | Lu, Yan , Sun, Shiduo , Zeng, Yongpan , Deng, Qingsong , Chen, Yanhui , Li, Yangzhong et al. Atomistic mechanism of nucleation and growth of a face-centered orthogonal phase in small-sized single-crystalline Mo . | MATERIALS RESEARCH LETTERS , 2020 , 8 (9) , 348-355 . |
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摘要 ：
Correlation between the ultimate tensile strength and the hardness of aluminum alloy 2219 and its joints welded with a variable-polarity tungsten electrode in inert gases (VPTIG) and by friction stir welding (FSW) is studied. The yield strength (sigma(y)) and the ultimate strength (sigma(r)) of the base metal, the microhardness and the strain hardening coefficient of the welded joints are determined. Linear correlation dependences are suggested for the yield strength, the ultimate strength, and the hardness. The strain hardening coefficient and the ratio sigma(y)/sigma(r)are shown to be correlated. The correlations are based on the measurement of microhardness and can be used for predicting the strength of fusion zones and heat-affected zones of aluminum alloys joined by a narrow weld.
关键词 ：
aluminum alloy 2219 aluminum alloy 2219 friction stir welding friction stir welding microhardness microhardness welding with variable-polarity tungsten electrode in inert gases welding with variable-polarity tungsten electrode in inert gases yield strength yield strength
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| GB/T 7714 | Li, Mian , Li, Xiaoyan , Li, Hui et al. A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints [J]. | METAL SCIENCE AND HEAT TREATMENT , 2020 , 62 (3-4) : 199-204 . |
| MLA | Li, Mian et al. "A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints" . | METAL SCIENCE AND HEAT TREATMENT 62 . 3-4 (2020) : 199-204 . |
| APA | Li, Mian , Li, Xiaoyan , Li, Hui , Niu, Lanqiang . A Study of Correlation between Tensile Strength and Hardness of Aluminum Alloy 2219 and its Welded Joints . | METAL SCIENCE AND HEAT TREATMENT , 2020 , 62 (3-4) , 199-204 . |
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摘要 ：
Purpose This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu3Sn proportion and joints with the conventional interfacial structure in electronic packaging. Design/methodology/approach The Cu-Sn IMCs joints with different Cu3Sn proportion were fabricated through soldering Cu-6 mu m Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 mu m Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints. Findings The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu3Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu3Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu3Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu3Sn and Cu6Sn5, occurred along the Cu3Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu3Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu3Sn. The inter-granular fracture, which led to the interfacial delamination of Cu3Sn and Cu, happened along the Cu/Cu3Sn interface. For the full Cu3Sn joint, the cleavage fracture happened within the Cu3Sn. Originality/value The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.
关键词 ：
Conventional interfacial structure Conventional interfacial structure Cu3Sn proportion Cu3Sn proportion Fracture mechanism Fracture mechanism Full Cu-Sn IMCs joints Full Cu-Sn IMCs joints Shear strength Shear strength
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| GB/T 7714 | Yao, Peng , Li, Xiaoyan , Han, Xu et al. Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2019 , 31 (1) : 6-19 . |
| MLA | Yao, Peng et al. "Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 31 . 1 (2019) : 6-19 . |
| APA | Yao, Peng , Li, Xiaoyan , Han, Xu , Xu, Liufeng . Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2019 , 31 (1) , 6-19 . |
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摘要 ：
Purpose The purpose of this paper is to investigate the diffusion behaviors of different atoms at the Cu/Cu3Sn interface and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy. Design/methodology/approach The diffusion behaviors of different atoms at the Cu/Cu3Sn interface are analyzed, and the vacancy formation energy, diffusion energy barrier and vacancy diffusion activation energy are obtained using molecular dynamics simulation. The nudged elastic band method is used to evaluate diffusion energy barrier for Cu/Cu3Sn system. Findings It is found that the vacancies in the Cu/Cu3Sn interface promote the interfacial diffusion, and the formation energy of Cu vacancy in the Cu crystal is larger than that in Cu3Sn crystal. In addition, the formation energies of Cu1 vacancy and Cu2 vacancy are close to each other in Cu3Sn crystal, and they are all less than the formation energy of Sn vacancy. Furthermore, the vacancy diffusion barrier and vacancy diffusion activation energy of the Cu/Cu3Sn interface are calculated, and the results show that the vacancy diffusion activation energy of Sn was higher than that of Cu. Finally, by comparison of diffusion activation energies of different diffusion mechanisms, Cu -> Cu1vac is the most possible migration path at all temperatures. Originality/value It is concluded that the vacancies in Cu/Cu3Sn interface promote interfacial diffusion, and the activation energy of vacancy diffusion in most diffusion mechanisms decreases with the increase of temperature.
关键词 ：
Cu/Cu3Sn Cu/Cu3Sn Diffusion activation energy Diffusion activation energy Diffusion energy barrier Diffusion energy barrier Molecular dynamics simulation Molecular dynamics simulation Vacancy Vacancy
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| GB/T 7714 | Li Yang , Li Xiaoyan , Peng Yao . The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2019 , 31 (1) : 28-39 . |
| MLA | Li Yang et al. "The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 31 . 1 (2019) : 28-39 . |
| APA | Li Yang , Li Xiaoyan , Peng Yao . The effect of vacancy on the interfacial diffusion in Cu/Sn lead-free solder joints . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2019 , 31 (1) , 28-39 . |
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摘要 ：
This study focuses on the Cu-Sn-Cu sandwich structure soldering, 0.06 MPa constant pressure. Different soldering temperatures and soldering times were selected based on the Cu-Sn binary phase diagram. After soldering according to different phase composition the solder joints can be divided into three types of residual Sn/Cu3Sn-Cu6Sn5-Cu3Sn/Cu-Cu3Sn-Cu. The relationship among shear strength of solder joints and three different phases compositions were researched by shear experiment of 1 mm/min loading rate and fracture morphology analysis. The results show that the shear strength of solder joints increases with the depletion of Sn and Cu6Sn5 in sequence. The shear strength of residual Sn solder joints, Cu3Sn-Cu6Sn5-Cu3Sn solder joints and Cu-Cu3Sn-Cu solder joints are 23.26, 33.59, 51.83 MPa, respectively. Based on the fracture morphology analysis, residual Sn solder joint fracture can distinguish the morphology of Sn/Cu6Sn5/Cu3Sn, indicating that the crack path through the Cu6Sn5 and Cu3Sn phases. In Cu3Sn-Cu6Sn5-Cu3Sn solder joint fracture, Cu6Sn5/Cu3Sn morphology was distinguished, crack path through the Cu3Sn phase. When only Cu3Sn phase was at solder joints, was Cu3Sn only Cu3Sn can be seen in fracture morphology of the soldering joints. © 2019, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
关键词 ：
Binary alloys Binary alloys Copper alloys Copper alloys Cracks Cracks Fracture Fracture Integrated circuit interconnects Integrated circuit interconnects Lead-free solders Lead-free solders Morphology Morphology Soldered joints Soldered joints Soldering Soldering Ternary alloys Ternary alloys Tin Tin
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| GB/T 7714 | Jin, Fengyang , Li, Xiaoyan , Yao, Peng . A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection [J]. | Transactions of the China Welding Institution , 2019 , 40 (2) : 58-63 . |
| MLA | Jin, Fengyang et al. "A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection" . | Transactions of the China Welding Institution 40 . 2 (2019) : 58-63 . |
| APA | Jin, Fengyang , Li, Xiaoyan , Yao, Peng . A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection . | Transactions of the China Welding Institution , 2019 , 40 (2) , 58-63 . |
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