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学者姓名：代岩伟
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摘要 ：
Under the operating conditions of high power and high switching frequency, an insulated gate bipolar transistor (IGBT) chip can produce relatively large power loss, causing the junction temperature to rise rapidly; consequently, the reliability of the IGBT module can be seriously affected. Therefore, it is necessary to accurately predict the junction temperature of the IGBT chip. The resistance capacitance (RC) thermal network model is a commonly used method for IGBT junction temperature prediction. In this paper, the model parameters are obtained by two methods to establish the Cauer thermal network models of the IGBT module. The first method is to experimentally obtain the transient thermal impedance curve of the IGBT module and the structure function and then extract the individual thermal parameters of the Cauer thermal network model; the second method is to obtain the thermal parameters of the thermal network model directly by using theoretical formulas that consider the influence of the heat spreading angle. The predicted junction temperatures of the Cauer thermal network models established by the two methods are compared with the junction temperatures obtained from infrared (IR) measurements during the power cycling test, the junction temperatures measured by the temperature-sensitive electrical parameter (TSEP) method, and the junction temperatures calculated by finite element (FE) analysis. Additionally, the Cauer thermal network models established by the two methods are compared and verified. The results indicate that the Cauer thermal network model established based on theoretical formulas can accurately predict the maximum junction temperature of the IGBT chip, and the calculated temperature for each layer, from the IGBT chip layer to the ceramic layer, also accords well with the FE results. The Cauer thermal network model established based on the experimental test and the structure function can accurately predict the average junction temperature of the IGBT chip.
关键词 ：
insulated gate bipolar transistor insulated gate bipolar transistor junction temperature junction temperature Cauer thermal network models Cauer thermal network models
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| GB/T 7714 | An, Tong , Zhou, Rui , Qin, Fei et al. Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module [J]. | ELECTRONICS , 2023 , 12 (7) . |
| MLA | An, Tong et al. "Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module" . | ELECTRONICS 12 . 7 (2023) . |
| APA | An, Tong , Zhou, Rui , Qin, Fei , Dai, Yanwei , Gong, Yanpeng , Chen, Pei . Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module . | ELECTRONICS , 2023 , 12 (7) . |
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摘要 ：
本发明一种面向图像模型的Ansys有限元计算的自动建模方法，本发明可以实现从图像提取模型的两种及以上的不同材料区域、将像素转换成有限单元模型、定义材料属性与边界条件、定义计算分析需求与结果输出，从而高效便捷地完成有限元模型的建立以及计算过程，直接通过Ansys软件参数化设计语言文件即APDL文件进行有限元模拟计算。本发明整个过程无需其他的建模软件及有限元模拟软件的手动操作。
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| GB/T 7714 | 代岩伟 , 隗嘉慧 , 秦飞 . 一种面向图像模型的Ansys有限元计算的自动建模方法 : CN202310600830.7[P]. | 2023-05-25 . |
| MLA | 代岩伟 et al. "一种面向图像模型的Ansys有限元计算的自动建模方法" : CN202310600830.7. | 2023-05-25 . |
| APA | 代岩伟 , 隗嘉慧 , 秦飞 . 一种面向图像模型的Ansys有限元计算的自动建模方法 : CN202310600830.7. | 2023-05-25 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
In this paper, the elastoplastic and creep constitutive behaviors of sintered silver with varying amounts of nickel-modified multiwall carbon nanotubes are studied through a systematic investigation of the nanoindentation test. Elastoplastic stress-strain curves for the sintered silver with different additive content are obtained based on reverse analysis. The addition of nickel-modified multiwall carbon nanotubes reduced the yielding stress from 110.68 MPa to 61.61 MPa and generally increased the strain-hardening exponent from 0.26 to 0.41. The initial and steady-state creep stress exponent remained almost unchanged. However, the creep coefficient increased remarkably. Otherwise, the yielding stress was confirmed to agree well with the Hall-Petch relation, and the hardening exponent was found to follow Morrison's law. The creep exponents and creep coefficients were also obtained and shown to be highly related to the particle size and positively correlated with porosity. The creep regime at room temperature was confirmed to obey Sherby's model. This investigation shows the effect of additive content on sintered silver. The study given in this paper could deepen the understanding of the strengthening effect of nickel-modified multiwall carbon nanotubes on the mechanical performance of sintered silver at room temperature.
关键词 ：
nanoindentation nanoindentation Sintered Ag Sintered Ag elastoplasticity elastoplasticity creep creep nickel-modified multiwall carbon nanotubes nickel-modified multiwall carbon nanotubes
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| GB/T 7714 | Dai, Yanwei , Zan, Zhi , Zhao, Libo et al. Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (3) : 1344-1359 . |
| MLA | Dai, Yanwei et al. "Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 3 (2023) : 1344-1359 . |
| APA | Dai, Yanwei , Zan, Zhi , Zhao, Libo , Qin, Fei . Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler . | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (3) , 1344-1359 . |
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摘要 ：
A fatigue crack growth rate model introducing corrosion damage is proposed in this paper, where the fracture parameter is modified by the damage variable and the exponential influence factor. The corrosion damage mechanism is coupled to the crack growth rate model, which quantifies the influence of the environment and reflects the interaction between corrosion and fatigue. To accurately predict the corrosion-fatigue crack growth life by the extended finite element method (XFEM), a simple crack surface updating method is developed. This method does not depend on the complex level set marching algorithm which often brings serious computational convergence problem, so it has good robustness and high efficiency. Moreover, the stress intensity factors at arbitrary crack tip can be calculated by combining the interaction integral method and the piecewise interpolation method, so it is suitable for the double crack-tip problem. The corrosionfatigue crack growth life is calculated based on the cycle-by-cycle method and the corresponding algorithm is developed. The corrosion-fatigue crack growth life can be accurately predicted by calculating the corrosion damage and crack propagation length under each load cycle. In this paper, sufficient examples are given to verify the accuracy of the proposed method in simulating crack propagation path and predicting corrosion-fatigue life. Finally, this method is well applied to a practical engineering structure.
关键词 ：
Extended finite element method Extended finite element method Crack growth rate model Crack growth rate model Fatigue life calculation Fatigue life calculation Corrosion damage Corrosion damage Crack surface update Crack surface update
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| GB/T 7714 | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method [J]. | ENGINEERING FRACTURE MECHANICS , 2023 , 289 . |
| MLA | Chen, Zhiying et al. "Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method" . | ENGINEERING FRACTURE MECHANICS 289 (2023) . |
| APA | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method . | ENGINEERING FRACTURE MECHANICS , 2023 , 289 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
Interface creep cracking is very common to be seen in various kinds of welded components which are used widely in engineering practice. In the present paper, the interface creep crack tip field by considering material mismatch effect is studied. The interface creep crack is found to be close to the HRR field which can produce the faster creep crack growth rate. A material mismatch constraint parameter is proposed based on the validation of the local mismatch effect on the interface creep crack tip field which also maintains the self-similarity. An averaged material mismatch constraint M*avg is presented to represent the material mismatch constraint effect. It reveals that the material mismatch constraint effect for interface creep crack decreases with the increase of the local mismatch factor. The physical meaning of the material mismatch constraint effect for the interface creep crack and its future application to engineering failure analysis is also discussed and presented.
关键词 ：
Stress field Stress field Self-similarity Self-similarity Material constraint Material constraint Material mismatch Material mismatch Interface creep crack Interface creep crack
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| GB/T 7714 | Dai, Yanwei , Qin, Fei , Liu, Yinghua et al. Influences of material mismatch on interface crack tip field in three layered creeping materials [J]. | ENGINEERING FAILURE ANALYSIS , 2022 , 140 . |
| MLA | Dai, Yanwei et al. "Influences of material mismatch on interface crack tip field in three layered creeping materials" . | ENGINEERING FAILURE ANALYSIS 140 (2022) . |
| APA | Dai, Yanwei , Qin, Fei , Liu, Yinghua , Chen, Haofeng . Influences of material mismatch on interface crack tip field in three layered creeping materials . | ENGINEERING FAILURE ANALYSIS , 2022 , 140 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
本发明公开了一种智能的SiC功率模块冷热冲击实验装置，该装置的主要功能是测试SiC功率模块短时间内经极高温与极低温连续环境下因热胀冷缩而引起的变化，对安全测试提供可靠性试验。整个箱体包括高温区、转换区、低温区，通过箱体门上菜单键完成对装置的启动、急停和温度曲线及循环次数的设置，通过箱门上显示屏显示高温区、低温区的环境温度和SiC功率模块的实时温度，通过转换区的载物台完成对SiC功率模块的装夹，通过环境加热器为高温区提供所需热量，通过风冷窗口为低温区提供恒定的环境温度，通过传递轴实现高温区和低温区的快速转换完成一次冷热冲击，通过箱体背部叶片透出冷风和热风，通过箱体门上可视玻璃观察整个测试过程。
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| GB/T 7714 | 代岩伟 , 王剑锋 , 秦飞 . 一种智能的SiC功率模块冷热冲击实验装置 : CN202211067558.2[P]. | 2022-09-01 . |
| MLA | 代岩伟 et al. "一种智能的SiC功率模块冷热冲击实验装置" : CN202211067558.2. | 2022-09-01 . |
| APA | 代岩伟 , 王剑锋 , 秦飞 . 一种智能的SiC功率模块冷热冲击实验装置 : CN202211067558.2. | 2022-09-01 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
Thermomechanical reliability assessment for sintered silver is a crucial issue as sintered silver is a promising candidate of die-attachment materials adopted for power devices. In this paper, the nano-indentation tests are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly although the microstructure of sintered silver also presents some variations. The stress and strain curves for different thermal cycling tests of sintered silver are also given based on reverse analysis of nano-indentation. The results show that the elastoplastic constitutive equations change significantly after thermal cycling tests, and the yielding stress decreases remarkably after 70 thermal cycles. The experimental investigation also shows that the cracking behaviors of sintered silver depend on its geometry characteristics, which implies that the possible optimization of sintered silver layer could enhance its thermomechanical performance.
关键词 ：
stress strain curve stress strain curve sintered silver sintered silver nano-indentation nano-indentation die-attach interconnection die-attach interconnection thermal cycling thermal cycling
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| GB/T 7714 | Qin, Fei , Zhao, Shuai , Dai, Yanwei et al. Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling [J]. | JOURNAL OF ELECTRONIC PACKAGING , 2022 , 144 (3) . |
| MLA | Qin, Fei et al. "Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling" . | JOURNAL OF ELECTRONIC PACKAGING 144 . 3 (2022) . |
| APA | Qin, Fei , Zhao, Shuai , Dai, Yanwei , Liu, Lingyun , An, Tong , Chen, Pei et al. Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling . | JOURNAL OF ELECTRONIC PACKAGING , 2022 , 144 (3) . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
The mismatch effect in weldment is widely to be found in engineering practices. In this paper, the material mismatch effect on the mode II creep crack tip field is investigated and discussed. The mismatch effect on the C (t)-integral is presented. Both the local mismatch and the general mismatch are found to play important role in C (t)-integral under mode II condition. The mismatch effect on the stress field of mode II creep crack is also studied. The two-order term solutions are adopted to characterize the material mismatch effect on the mode II creep crack. The effect of creep coefficient, creep exponent as well as the HAZ thickness on the high order term solutions are also presented. Some typical cases by considering general mismatch and local mismatch effect are given to make a comparisons between the HRR field, FE solutions and the two-order term solutions. It can be seen that the two-order term solutions can coincide with the full field FE solutions quite reasonably regardless of creep extent, creep exponent, mismatch factor, and HAZ thickness. The material mismatch effect on the high order term solutions is significant under some conditions. A theoretical formula is presented to show the implication of material mismatch effect on creep crack growth under mode II condition based on stress damage model.
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| GB/T 7714 | Dai, Yanwei , Qin, Fei , Liu, Yinghua et al. Characteristics and implications of material mismatch on mode II creep crack tip field: Theoretical analysis and numerical investigation [J]. | THEORETICAL AND APPLIED FRACTURE MECHANICS , 2021 , 114 . |
| MLA | Dai, Yanwei et al. "Characteristics and implications of material mismatch on mode II creep crack tip field: Theoretical analysis and numerical investigation" . | THEORETICAL AND APPLIED FRACTURE MECHANICS 114 (2021) . |
| APA | Dai, Yanwei , Qin, Fei , Liu, Yinghua , Chen, Haofeng , Berto, Filippo . Characteristics and implications of material mismatch on mode II creep crack tip field: Theoretical analysis and numerical investigation . | THEORETICAL AND APPLIED FRACTURE MECHANICS , 2021 , 114 . |
| 导入链接 | NoteExpress RIS BibTex |
摘要 ：
A two-order asymptotic solution for sharp V-notch tip mechanics field in elasto-viscoplastic solids with power-law form under mode I loading is developed. The stress exponents and angular distributions for various notch angles and viscoplastic exponents for the second terms are reported. The stress exponent of the first order is singular and is non-singular except for low creep exponent with small notch opening angle. Compared with finite element results from several V-notched specimens, it is found that the two-order solution can have a better estimate for those cases with small notch opening angles, e.g., α = 30° under n = 5, than that of one-order solution regardless of viscoplastic extent, specimen type and loading level. One-order term solution is demonstrated to be sufficient to characterize the full field of sharp V-notch specimen for those conditions that elastic term is considered into higher order term, e.g., α = 60° under n = 5, in all specimens under various viscoplasticity extents. © 2021 Elsevier Ltd
关键词 ：
Plasticity Plasticity Asymptotic analysis Asymptotic analysis Stress analysis Stress analysis Viscoplasticity Viscoplasticity
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| GB/T 7714 | Dai, Yanwei , Qin, Fei , Liu, Yinghua et al. On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids [J]. | International Journal of Solids and Structures , 2021 , 217-218 : 106-122 . |
| MLA | Dai, Yanwei et al. "On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids" . | International Journal of Solids and Structures 217-218 (2021) : 106-122 . |
| APA | Dai, Yanwei , Qin, Fei , Liu, Yinghua , Chao, Yuh J. . On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids . | International Journal of Solids and Structures , 2021 , 217-218 , 106-122 . |
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摘要 ：
Material mismatch effect on the cracking behavior is an important topic for those welding structures. Characterization of the material constraint effect based on rigorously asymptotic solution is studied in this paper. Based on decomposition of the second order term, the constraint effect characterization parameter is decomposed as material constraint parameter and geometry constraint parameter. In general, the total constraint level for crack tip under undermatch condition is higher than overmatch condition. The specimen with positive biaxiality could lead to a higher constraint level compared with that of negative biaxiality. Geometry constraint effect and material constraint effect could not be separated independently from rigorously asymptotic solution for those cases with positive biaxiality. For a crack tip field under non-positive biaxiality, the material constraint effect can be characterized independently although it is approximate. For these conditions, the proposed material constraint effect and geometry constraint effected characterized are approximately independent on material mismatch factor, crack depth ratio and stress biaxiality. An empirical formula has been presented to characterize the geometry constraint effect and material constraint effect for the crack tip in the weldment under biaxial loading, which has been verified with fine accuracy.
关键词 ：
Higher order asymptotic solution Higher order asymptotic solution Mismatch factor Mismatch factor Constraint effect Constraint effect Material constraint Material constraint Biaxial loading Biaxial loading
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| GB/T 7714 | Dai, Yanwei , Qin, Fei , Liu, Yinghua et al. Characterizations of material constraint effect for creep crack in center weldment under biaxial loading [J]. | INTERNATIONAL JOURNAL OF FRACTURE , 2021 , 234 (1-2) : 177-193 . |
| MLA | Dai, Yanwei et al. "Characterizations of material constraint effect for creep crack in center weldment under biaxial loading" . | INTERNATIONAL JOURNAL OF FRACTURE 234 . 1-2 (2021) : 177-193 . |
| APA | Dai, Yanwei , Qin, Fei , Liu, Yinghua , Berto, Filippo , Chen, Haofeng . Characterizations of material constraint effect for creep crack in center weldment under biaxial loading . | INTERNATIONAL JOURNAL OF FRACTURE , 2021 , 234 (1-2) , 177-193 . |
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