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Strengthening mechanisms of femtosecond laser fabricated multi-phase ZrNbMoTaW body-centered cubic refractory high entropy alloy with enhanced hardness SCIE
期刊论文 | 2024 , 983 | JOURNAL OF ALLOYS AND COMPOUNDS
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Abstract :

The present work reports a new fabrication method for refractory high-entropy alloy (RHEA) based on femtosecond laser. The strengthening mechanisms in ZrNbMoTaW body centered cubic RHEA prepared via femtosecond laser fabricating are discussed comprehensively. By analyzing the mechanical properties of femtosecond laser fabricated ZrNbMoTaW RHEAs with different processing parameters, the optimal femtosecond laser fabricating window of ZrNbMoTaW RHEAs with enhanced microhardness and low porosity was obtained. The grain morphology, phase structure, elemental distribution, local misorientation and lattice parameters of ZrNbMoTaW RHEA at optimized processing parameters were investigated. The instantaneous fabricating temperature was measured to analyze the effect of femtosecond laser on powder melting. The results show that the microstructure of ZrNbMoTaW RHEA consists of homogeneous BCC1 and BCC2 phase distribution with refined grains (sizeave = 2.1 mu m). Based on the numerical deduction of RHEA with enhanced hardness, contributions to the multiple strengthening mechanisms are given to establish the relationship between the microstructure and hardness of femtosecond laser fabricating ZrNbMoTaW RHEAs, including frictional stress (16.4%), dislocation hardening (17.9%), grain boundary strengthening (9.9%) and solid solution strengthening (55.8%), respectively. Adequate solid solution effect, high dislocation density and low grain size endow ZrNbMoTaW RHEA with high hardness (Vickersvalue = 565.7 HV). These suggest that femtosecond laser is influential in governing the mutual solubility of multiple elements and introduction of strengthening factors. The revealed strengthening mechanisms can serve as a basis for design and the improvement of mechanical properties in NbMoTaW-based RHEAs.

Keyword :

Microstructure Microstructure Mechanical property Mechanical property Strengthening mechanism Strengthening mechanism Refractory high-entropy alloy Refractory high-entropy alloy Femtosecond laser Femtosecond laser

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GB/T 7714 Cheng, Wei , Zhang, Litian , Ji, Lingfei . Strengthening mechanisms of femtosecond laser fabricated multi-phase ZrNbMoTaW body-centered cubic refractory high entropy alloy with enhanced hardness [J]. | JOURNAL OF ALLOYS AND COMPOUNDS , 2024 , 983 .
MLA Cheng, Wei 等. "Strengthening mechanisms of femtosecond laser fabricated multi-phase ZrNbMoTaW body-centered cubic refractory high entropy alloy with enhanced hardness" . | JOURNAL OF ALLOYS AND COMPOUNDS 983 (2024) .
APA Cheng, Wei , Zhang, Litian , Ji, Lingfei . Strengthening mechanisms of femtosecond laser fabricated multi-phase ZrNbMoTaW body-centered cubic refractory high entropy alloy with enhanced hardness . | JOURNAL OF ALLOYS AND COMPOUNDS , 2024 , 983 .
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20 μm Micro-LEDs Mass Transfer via Laser-Induced In Situ Nanoparticles Resonance Enhancement SCIE
期刊论文 | 2024 , 20 (27) | SMALL
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Ultrafast laser is expected as a promising strategy for micro-LEDs (mu-LEDs) transfer due to its inherent property of suppressing thermal effects. However, its ultrahigh peak power and the unclear transfer mechanism make its transfer quality and efficiency unsatisfactory. Here, the study reports the high-precision mass transfer of 20 mu m fine-pitch mu-LEDs via in situ nanoparticles (NPs) resonance enhancement in burst mode ultraviolet picosecond laser irradiation. This technique suppresses the thermal melting effect and rapid cooling behavior of plasma by temporal modulation of the burst mode, generating NPs-induced resonance enhancement that accurately and controllable drives a single unit up to tens of thousands of mu-LEDs. The transfer of large mu-LED arrays with more than 180 000 chips is also demonstrated, showing a transfer yield close to 99.9%, a transfer speed of 700 pcs s(-1), and a transfer error of <+/- 1.2 mu m. The transferred mu-LEDs perform excellent optoelectronic properties and enable reliable device operation regardless of complex strain environments, providing a reliable strategy for preparing broader classes of 3D integrated photonics devices.

Keyword :

laser mass transfer laser mass transfer flexible electronics flexible electronics microscale light-emitting diodes microscale light-emitting diodes plasmon resonance plasmon resonance burst mode burst mode

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GB/T 7714 Sun, Weigao , Ji, Lingfei , Lin, Zhenyuan et al. 20 μm Micro-LEDs Mass Transfer via Laser-Induced In Situ Nanoparticles Resonance Enhancement [J]. | SMALL , 2024 , 20 (27) .
MLA Sun, Weigao et al. "20 μm Micro-LEDs Mass Transfer via Laser-Induced In Situ Nanoparticles Resonance Enhancement" . | SMALL 20 . 27 (2024) .
APA Sun, Weigao , Ji, Lingfei , Lin, Zhenyuan , Zhang, Litian , Wang, Zhiyong , Qin, Wenbin et al. 20 μm Micro-LEDs Mass Transfer via Laser-Induced In Situ Nanoparticles Resonance Enhancement . | SMALL , 2024 , 20 (27) .
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Crack propagation characteristics and inhibition mechanism for laser high-efficient drilling of bone SCIE
期刊论文 | 2023 , 291 | ENGINEERING FRACTURE MECHANICS
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Investigations into heterogeneous bone cracking during laser drilling are limited. This work investigated the crack propagation and inhibition mechanism in laser bone drilling. Effects of input laser parameters on the stress intensity factors and the cracking trajectories concerning bone structure are analyzed. It is shown that cracks preferentially deflected along the cement line, and crack patterns were defined into three types via fractal evaluation. Stress intensity factor at a laser scanning speed of 4 mm/s (1.59 MPa center dot m(1/)2) was regulated to lower than bone fracture toughness, leading to crack size less than 100 mu m while maintaining high drilling efficiency (0.23 mm(3)/s).

Keyword :

Laser drilling Laser drilling Crack propagation Crack propagation Finite element method Finite element method Fractal evaluation Fractal evaluation Bone tissue Bone tissue

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GB/T 7714 Chen, Mengxue , Ji, Lingfei , Zhang, Litian et al. Crack propagation characteristics and inhibition mechanism for laser high-efficient drilling of bone [J]. | ENGINEERING FRACTURE MECHANICS , 2023 , 291 .
MLA Chen, Mengxue et al. "Crack propagation characteristics and inhibition mechanism for laser high-efficient drilling of bone" . | ENGINEERING FRACTURE MECHANICS 291 (2023) .
APA Chen, Mengxue , Ji, Lingfei , Zhang, Litian , Cao, Lijie , Wei, Hangru , Sun, Weigao . Crack propagation characteristics and inhibition mechanism for laser high-efficient drilling of bone . | ENGINEERING FRACTURE MECHANICS , 2023 , 291 .
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Precision machining of single crystal diamond cutting tool via picosecond laser irradiation SCIE
期刊论文 | 2023 , 114 | INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS
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Due to its high hardness and excellent wear resistance, single crystal diamond has been widely applied in me-chanical processing. However, the outstanding hardness leads to great difficulties in the machining of diamond by traditional strategies. In this study, a synchronous feed laser method is developed to realize low damage, high efficiency, and high precision machining of single crystal diamond cutting tools. The disadvantages of traditional direct laser machining, including fullerene residue, bending behavior, and the plasma-shield effect, are well avoided by the good control of the scanning path during the laser fabrication, which enlarges the entrance of the kerf and reduces the air pressure inside the kerf. The synchronous feed laser machining can realize the remarkable increase of kerf depth at high speed, as well as a minimum roughness of-147 nm on the cutting surface. It provides a novel, high efficiency, and high precision strategy for the preparation of high quality single crystal diamond tools.

Keyword :

Picosecond laser Picosecond laser Diamond Diamond Cutting tool Cutting tool Synchronous feed machining Synchronous feed machining

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GB/T 7714 Lin, Zhenyuan , Ji, Lingfei , Wang, Wenhao . Precision machining of single crystal diamond cutting tool via picosecond laser irradiation [J]. | INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS , 2023 , 114 .
MLA Lin, Zhenyuan et al. "Precision machining of single crystal diamond cutting tool via picosecond laser irradiation" . | INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS 114 (2023) .
APA Lin, Zhenyuan , Ji, Lingfei , Wang, Wenhao . Precision machining of single crystal diamond cutting tool via picosecond laser irradiation . | INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS , 2023 , 114 .
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Refractory high-entropy alloys fabricated using laser technologies: a concrete review SCIE
期刊论文 | 2023 , 24 , 7497-7524 | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
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Refractory high-entropy alloys (RHEAs) have attracted widespread attention in recent years as multi-component alloys applied to high-temperature fields. High melting point ele-ments endow special microstructures and properties to RHEAs, which differ from those of conventional alloys and pose a challenge to conventional fabricating technologies. Laser fabrication technologies are attractive in fabricating RHEAs since a high-power density laser beam can be used as a controllable heat source to quickly melt refractory elements and then followed by rapid cooling and solidification to optimize the dependent properties. This paper reviews recent research progress in the fabricating process and the influence of processing on microstructural evolution and phase formation of laser-fabricated RHEAs, aiming to address the use of laser technologies for improving room temperature and high -temperature properties of RHEAs, thereby providing a reference for research community. The current methods of laser fabricating RHEAs, namely selective laser melting, laser metal deposition and laser cladding, are first introduced, and then the relationships between chemical composition, microstructure and properties of RHEAs are analyzed from exper-imental and simulation perspectives. In addition, the microhardness, oxidation resistance, wear resistance, corrosion resistance, irradiation resistance, and biocompatibility of laser fabricated RHEAs are discussed. Finally, the critical challenges and opportunities for laser fabricating RHEAs in the research field are highlighted, based on the research perspective of this topic.& COPY; 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Keyword :

Refractory Refractory High entropy alloys High entropy alloys Laser technologies Laser technologies Microstructure Microstructure Properties Properties

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GB/T 7714 Cheng, Wei , Ji, Lingfei , Zhang, Litian et al. Refractory high-entropy alloys fabricated using laser technologies: a concrete review [J]. | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T , 2023 , 24 : 7497-7524 .
MLA Cheng, Wei et al. "Refractory high-entropy alloys fabricated using laser technologies: a concrete review" . | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T 24 (2023) : 7497-7524 .
APA Cheng, Wei , Ji, Lingfei , Zhang, Litian , Wang, Hao , Sun, Weigao . Refractory high-entropy alloys fabricated using laser technologies: a concrete review . | JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T , 2023 , 24 , 7497-7524 .
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一种基于点阵列在线分析的超快激光材料损伤测试方法 incoPat
专利 | 2022-11-23 | CN202211477062.2
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本发明涉及一种基于点阵列在线分析的超快激光材料损伤测试方法,所述方法包括:用图像采集方法在线获取损伤前后材料表面图像并通过图像处理得到损伤前后差异信息的方法以识别表面的损伤点阵列;在上述识别的点阵列中间区域选取需要观测的全部点数N, N与测试工艺参数之间应满足(I/vXf>2N, 且N>10);用二值法识别N中的损伤点数(N')并进行损伤概率(mi=N/NX100%, 其中点阵列组别i=1、2...n)分析,通过判别m;是否为0来确保实验的准确性,若mn+1=0则认定m对应的激光能量密度为材料的超快激光损伤阈值,并同时输出横轴为激光能量密度,纵轴为损伤概率点的分布图。

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GB/T 7714 季凌飞 , 温亚楠 , 郑锦灿 et al. 一种基于点阵列在线分析的超快激光材料损伤测试方法 : CN202211477062.2[P]. | 2022-11-23 .
MLA 季凌飞 et al. "一种基于点阵列在线分析的超快激光材料损伤测试方法" : CN202211477062.2. | 2022-11-23 .
APA 季凌飞 , 温亚楠 , 郑锦灿 , 王玉恒 . 一种基于点阵列在线分析的超快激光材料损伤测试方法 : CN202211477062.2. | 2022-11-23 .
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一种激光机器人加工自适应定位方法 incoPat
专利 | 2022-12-01 | CN202211532116.0
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本发明公开了一种激光机器人加工自适应定位方法,属于机器人控制技术领域,所述方法包括:通过传感器获得待加工材料的结构光数据;基于所述结构光数据,获得激光与目标点的偏差角度;基于所述偏差角度、以及待加工材料的散射和吸收系数,获得目标点的进给量;基于所述进给量和偏差角度,生成激光机器人的运动轨迹。基于材料的散射和吸收系数、以及结构光数据,获得与目标点的偏差角和进给量,并生成激光机器人运动轨迹/自适应路径,提高加工的准确性。

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GB/T 7714 季凌飞 , 韦杭汝 , 张犁天 . 一种激光机器人加工自适应定位方法 : CN202211532116.0[P]. | 2022-12-01 .
MLA 季凌飞 et al. "一种激光机器人加工自适应定位方法" : CN202211532116.0. | 2022-12-01 .
APA 季凌飞 , 韦杭汝 , 张犁天 . 一种激光机器人加工自适应定位方法 : CN202211532116.0. | 2022-12-01 .
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基于反射光谱的激光器参数自动调控方法 incoPat
专利 | 2022-05-17 | CN202210531991.0
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基于反射光谱的激光器参数自动调控方法,涉及激光加工和自动化控制领域。该方法可在靶材被激光消融之前,精准调试出适合该靶材加工的激光参数。根据激光频率及通讯频率自定义光谱积分参数,采集激光消融多组分靶材过程中的反射光谱数据;提取光谱特征参数,以95%置信区间为标准建立光谱特征参数与此时待消融靶材所需激光参数的主成分回归模型;当激光消融过程中暴露出待去除靶材时,重复前述步骤,再次调试出适用于新靶材消融的激光参数;在激光消融过程中根据反射光谱数据对激光参数进行实时闭环调控,实现靶材的高度选择性、无损去除。在高效、高质、高精激光材料加工等领域具有重大的应用前景。

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GB/T 7714 季凌飞 , 曹丽杰 , 张犁天 . 基于反射光谱的激光器参数自动调控方法 : CN202210531991.0[P]. | 2022-05-17 .
MLA 季凌飞 et al. "基于反射光谱的激光器参数自动调控方法" : CN202210531991.0. | 2022-05-17 .
APA 季凌飞 , 曹丽杰 , 张犁天 . 基于反射光谱的激光器参数自动调控方法 : CN202210531991.0. | 2022-05-17 .
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一种用于激光显微检测的双光束合路方法与装置 incoPat
专利 | 2021-06-16 | CN202110664441.1
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本发明公开了一种用于激光显微检测的双光束合路方法与装置。所述方法包括:双路激光的并列布置设计和独立调节;双路激光光束的偏振状态调节、光束整形优化、偏转角度调节以及激光光束的合路与调节;并通过样品反射光分束至CCD,实现显微检测过程中的样品内部成像与观测。所述的装置包括:双光束合路单元外壳、盖板、固定螺钉、双路激光入口、偏振器件、光束整形器件、偏转镜、偏转调节器件、合束器件、合路激光调节器件、分光镜、CCD、合束激光出口等。通过实现双路激光的整形、偏转和调节,可支持激光显微检测系统对芯片等微结构微器件进行快速扫描、精确检测。

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GB/T 7714 季凌飞 , 薛岩 , 郑锦灿 . 一种用于激光显微检测的双光束合路方法与装置 : CN202110664441.1[P]. | 2021-06-16 .
MLA 季凌飞 et al. "一种用于激光显微检测的双光束合路方法与装置" : CN202110664441.1. | 2021-06-16 .
APA 季凌飞 , 薛岩 , 郑锦灿 . 一种用于激光显微检测的双光束合路方法与装置 : CN202110664441.1. | 2021-06-16 .
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一种用于芯片检测的双点激光显微检测装置 incoPat
专利 | 2021-05-12 | CN202121008881.3
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本实用新型公开了一种用于芯片检测的双点激光显微检测装置,属于光学工程/无损检测领域。包括双路激光模组、转接环、光学合路单元、红外CCD、照明光源、显微镜、可调节支架、样品台、旋转台、X‑Y位移台和基座等。双路激光模组由两台激光器组合而成,激光模组通过转接环与光学合路单元链接并固定,模组中的两路激光通过光学合路单元的整形、偏转和合束后进入显微镜;显微镜和光学合路单元通过可调节固定支架组合,红外CCD和照明光源分别与光学合路单元、显微镜连接,以提供所述装置的显微成像和照明功能;该实用新型通过实现双路激光的整形、偏转和调节,可进行芯片等微结构微器件的快速扫描、精确检测。

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GB/T 7714 季凌飞 , 薛岩 , 郑锦灿 . 一种用于芯片检测的双点激光显微检测装置 : CN202121008881.3[P]. | 2021-05-12 .
MLA 季凌飞 et al. "一种用于芯片检测的双点激光显微检测装置" : CN202121008881.3. | 2021-05-12 .
APA 季凌飞 , 薛岩 , 郑锦灿 . 一种用于芯片检测的双点激光显微检测装置 : CN202121008881.3. | 2021-05-12 .
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