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学者姓名：郭福
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摘要 ：
The crystal structures, stability, mechanical behaviors, thermodynamic properties and electronic structures of Al2Si2La and Al2Si2Pr compounds have been investigated by means of first-principles calculations. It is revealed from formation enthalpies that Al2Si2La exhibit much more thermodynamically stability. According to the results of elastic constants, Al2Si2Pr has stronger incompressibility, stronger shape deformation resistance and higher stiffness. It can be concluded from Debye temperature and minimum thermal conductivity that Al2Si2Pr and Al2Si2La exhibit nearly the same thermal conductivity. Electronic structures results demonstrate that the Al-Si bonds in Al2Si2La and Al2Si2Pr are attributed to the hybridization of Al 3s state, Al 3p state and Si 3p state, while RE-Si bonds are the contribution of Si 3p state and La 5d or Pr 4f state in Al2Si2La and Al2Si2Pr, respectively.
关键词 ：
Electronic structure Electronic structure Debye temperature Debye temperature Thermodynamic Thermodynamic First-principles calculations First-principles calculations Formation enthalpy Formation enthalpy Mechanical property Mechanical property
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| GB/T 7714 | Tan, Yong , Guo, Fu . Insight into mechanical and thermodynamic properties of Al2Si2La and Al2Si2Pr from first-principles calculations [J]. | JOURNAL OF SOLID STATE CHEMISTRY , 2022 , 305 . |
| MLA | Tan, Yong 等. "Insight into mechanical and thermodynamic properties of Al2Si2La and Al2Si2Pr from first-principles calculations" . | JOURNAL OF SOLID STATE CHEMISTRY 305 (2022) . |
| APA | Tan, Yong , Guo, Fu . Insight into mechanical and thermodynamic properties of Al2Si2La and Al2Si2Pr from first-principles calculations . | JOURNAL OF SOLID STATE CHEMISTRY , 2022 , 305 . |
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摘要 ：
废线路板非金属材料回收利用技术现状与展望
关键词 ：
非金属材料 非金属材料 废线路板 废线路板 回收 回收
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| GB/T 7714 | 郝娟娟 , 王乙舒 , 吴玉峰 et al. 废线路板非金属材料回收利用技术现状与展望 [J]. | 郝娟娟 , 2021 , 35 (7) : 7001-7012 . |
| MLA | 郝娟娟 et al. "废线路板非金属材料回收利用技术现状与展望" . | 郝娟娟 35 . 7 (2021) : 7001-7012 . |
| APA | 郝娟娟 , 王乙舒 , 吴玉峰 , 郭福 , 材料导报 . 废线路板非金属材料回收利用技术现状与展望 . | 郝娟娟 , 2021 , 35 (7) , 7001-7012 . |
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摘要 ：
近年来,随着科学技术的快速发展和生活水平的不断提高,人们对电子电气设备的需求量不断增加。随着生活质量的提高,人们逐渐追求电子电气设备多功能化、轻便化,造成电子电气设备寿命不断缩短,更新换代速度加快。世界范围内废电子电气设备数量以惊人的速度增长,其成分复杂,含有多种金属元素以及有毒有害物质,对资源回收以及环境保护既是机遇也是挑战。废线路板作为废电子电气设备的主要部件,含有多种金属元素,且含量高于相应矿产,具有很高的回收价值。由于金属材料具有高的经济价值,其回收引起世界广泛关注,很多研究致力于探索高效、环保的金属材料回收方法,目前关于金属材料的回收技术已经十分成熟。然而,由于回收经济效益低,在线路...
关键词 ：
非金属材料 非金属材料 回收 回收 废线路板 废线路板
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| GB/T 7714 | 郝娟娟 , 王乙舒 , 吴玉峰 et al. 废线路板非金属材料回收利用技术现状与展望 [J]. | 材料导报 , 2021 , 35 (07) : 7001-7012 . |
| MLA | 郝娟娟 et al. "废线路板非金属材料回收利用技术现状与展望" . | 材料导报 35 . 07 (2021) : 7001-7012 . |
| APA | 郝娟娟 , 王乙舒 , 吴玉峰 , 郭福 . 废线路板非金属材料回收利用技术现状与展望 . | 材料导报 , 2021 , 35 (07) , 7001-7012 . |
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摘要 ：
To increase the strength and wear resistance of material surfaces, various combinations of B4C and 80TiFe powder were mixed into a Fe60 self-fluxing alloy powder; the composite coatings reinforced by TiB2-TiC were successfully prepared on Q235 steel surfaces by laser cladding. Scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) were used to study the microstructure and chemical and phase composition. Microhardness and wear testers were used to investigate the mechanical properties. The results show that the interfaces of composite coatings and substrate materials are excellent for metallurgical bonding. The block-like TiB2 particles and flower-like TiC particles are uniformly distributed in the cladding coating. When the mass fraction of the mixed powder is 30%, the average microhardness of the coating is approximately 1100 HV0.2, which is 50% higher than that without the mixed powder, and demonstrates the best wear with a performance twice as better as that of the substrate. © 2021 World Scientific Publishing Company.
关键词 ：
Energy dispersive spectroscopy Energy dispersive spectroscopy Wear resistance Wear resistance Scanning electron microscopy Scanning electron microscopy Laser cladding Laser cladding Composite coatings Composite coatings Chemical bonds Chemical bonds Powder coatings Powder coatings Microhardness Microhardness Titanium carbide Titanium carbide Microstructure Microstructure Boron carbide Boron carbide Wear of materials Wear of materials
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| GB/T 7714 | Yang, Tianwei , Wang, Zhaohui , Tan, Shihai et al. Microstructure and wear resistance of in-situ synthesized tib2-Tic/fe composite coating by laser cladding [J]. | Surface Review and Letters , 2021 , 28 (2) . |
| MLA | Yang, Tianwei et al. "Microstructure and wear resistance of in-situ synthesized tib2-Tic/fe composite coating by laser cladding" . | Surface Review and Letters 28 . 2 (2021) . |
| APA | Yang, Tianwei , Wang, Zhaohui , Tan, Shihai , Guo, F.U. . Microstructure and wear resistance of in-situ synthesized tib2-Tic/fe composite coating by laser cladding . | Surface Review and Letters , 2021 , 28 (2) . |
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摘要 ：
为了研究焊点拉伸力学性能,选取尺寸相同、晶体取向相似的Sn3.0Ag0.5Cu(SAC305)钎焊接头与Sn3.0Ag3.0Bi3.0In(SABI333)钎焊接头进行相同拉伸速度的拉伸实验.同时,选取SABI333钎焊接头中尺寸相同的单晶焊点与孪晶焊点进行相同拉伸速度的拉伸实验.利用EBSD与SEM对焊点的晶体取向和表面形貌进行表征.结果表明:SABI333焊点的抗拉强度远高于SAC305焊点,并且2种不同成分的焊点呈现完全不同的断裂方式. SAC305焊点发生韧性断裂,SABI333焊点在发生微量塑性变形之后断裂. SABI333焊点中单晶焊点和孪晶焊点在拉伸过程中表现出不同的拉伸性能.孪...
关键词 ：
孪晶焊点 孪晶焊点 Sn3.0Ag3.0Bi3.0In焊点 Sn3.0Ag3.0Bi3.0In焊点 晶界 晶界 拉伸试验 拉伸试验 表面形貌 表面形貌 抗拉强度 抗拉强度
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| GB/T 7714 | 马立民 , 翟广涛 , 郭福 et al. SABI333焊点拉伸性能及晶界对焊点拉伸性能影响 [J]. | 北京工业大学学报 , 2021 , 47 (09) : 1074-1082 . |
| MLA | 马立民 et al. "SABI333焊点拉伸性能及晶界对焊点拉伸性能影响" . | 北京工业大学学报 47 . 09 (2021) : 1074-1082 . |
| APA | 马立民 , 翟广涛 , 郭福 , 王乙舒 . SABI333焊点拉伸性能及晶界对焊点拉伸性能影响 . | 北京工业大学学报 , 2021 , 47 (09) , 1074-1082 . |
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摘要 ：
Because large plastic deformation occurs in hydroforming bellows there is a residual stress distributing in the metal after forming, which is complex and not easy to be measured. The existence of residual stress might have an effect on the corrosive property and bulking performance of bellows. A finite element model was established to simulate the forming residual stress of the nickel alloy multi-layer bellow. The distribution of residual stress was calculated out and validated by cos alpha X-ray diffraction measurement. Thus the forming mechanics and the effects of layer number and forming pressure on the residual stress in the hydroforming bellow were both discussed in detail based on the established model. It was shown that the calculated residual stress had the same trend with the experimental results. The axial and circumferential residual stresses at the outer surface of the peak were both compressive. There existed the maximal Von Mises stress at the inner surface of the peak of the bellow. At this position the radial and axial residual stresses were both tensile. When applying multi-layer bellows and less forming pressure a lower forming residual stress could be obtained because of the narrow plastic strain region during forming.
关键词 ：
Multi-layer bellows Multi-layer bellows Nickel alloy Nickel alloy Numerical modeling Numerical modeling Residual stress Residual stress X-ray diffraction measurement X-ray diffraction measurement
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| GB/T 7714 | Lin, Jian , Wang, Xibo , Lei, Yongping et al. Residual stress analysis and measurement in multi-layer bellows [J]. | JOURNAL OF MANUFACTURING PROCESSES , 2021 , 72 : 179-194 . |
| MLA | Lin, Jian et al. "Residual stress analysis and measurement in multi-layer bellows" . | JOURNAL OF MANUFACTURING PROCESSES 72 (2021) : 179-194 . |
| APA | Lin, Jian , Wang, Xibo , Lei, Yongping , Ding, Jianchun , Li, Kangli , Guo, Fu . Residual stress analysis and measurement in multi-layer bellows . | JOURNAL OF MANUFACTURING PROCESSES , 2021 , 72 , 179-194 . |
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摘要 ：
In recent years, with the rapid development of science and technology and the continuous improvement of the standard of living, the demand for electronic and electrical equipment (EEE) continues to increase. With the improvement of the quality of life, electronic and electrical equipment, resulting in the continuous shortening of the life of electronic and electrical equipment, and the speed of upgrading with the improvement of life quality, people are gradually pursuing the multi-function and portability of EEE, which resulted in that the service life of EEE is shorten continually and the speed of replacement is accelerated. The number of waste electronic and electrical equipment (WEEE) in the world is growing at an alarming rate. The composition of WEEE is very complex containing a variety of metal elements and harmful substances, which make it be both an opportunity and a challenge for resource recovery and environmental protection. As the main component of WEEE, waste printed circuit boards (WPCBs), which contain a variety of metal elements whose content is higher than the corresponding mineral products, have high reco-very value. Due to the high economic value, the recycling of metal materials has attracted worldwide attention. Many researches have explored many efficient and environmental friendly methods to recycle metal materials. At present, the recycling technologies of metal materials have been very mature. However, the non-metal materials, which accounts for a large proportion in WPCBs, are often neglected due to the low economic value. The common recycling techniques of non-metal materials are incineration or landfill. The non-metal material contains heavy metals, brominated flame retardants and other harmful substances, toxic gases such as dioxins, polybrominated diphenyls and dibenzofurans would be produced during the incineration process. In addition, landfill will lead to secondary groundwater pollution because of the leaching of heavy metals and brominated flame retardants. With the increasing of environmental awareness, the recycling of non-metal materials has attracted more and more attention to avoid resources waste and environmental pollution. At present, a lot of researches have been done to recover non-metal mate-rials from WPCBs. At this paper, the technologies and current situation of non-metal materials recycling are elaborated based on the existing researches. And the future trend of non-metal materials recycling is also discussed. At present, the methods of non-metal materials recovery include physical recovery methods and chemical recovery methods, which could recover and utilize the non-metal materials effectively. The phy-sical methods use the separated non-metallic materials as fillers, raw materials or modifiers to produce thermosetting resin matrix composites and thermoplastic resin matrix composites, concrete and viscoelastic materials. These methods could change the properties of materials and reduce the production cost of the materials by replacing the original materials using non-metal materials. Chemical recovery methods mainly include pyrolysis, liquid depolymerization and hydrogenation degradation. Among them, the pyrolysis recovery method has received more attention than other methods. Much work needs to be done on the recovery of non-metal materials by liquid depolymerization and hydrogenation degradation. This paper summarizes and compares the advantages and problems of various methods based on cost and environmental impact. And a reference is provided for the future development trend of non-metal materials recycling. © 2021, Materials Review Magazine. All right reserved.
关键词 ：
Air pollution Air pollution Electronic Waste Electronic Waste Environmental protection Environmental protection Flame retardants Flame retardants Groundwater Groundwater Groundwater pollution Groundwater pollution Heavy metals Heavy metals Hydrogenation Hydrogenation Inclusions Inclusions Land fill Land fill Metallic matrix composites Metallic matrix composites Metal recovery Metal recovery Polymer matrix composites Polymer matrix composites Printed circuit boards Printed circuit boards Pyrolysis Pyrolysis Recycling Recycling Resins Resins Timing circuits Timing circuits Viscoelasticity Viscoelasticity Waste incineration Waste incineration
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| GB/T 7714 | Hao, Juanjuan , Wang, Yishu , Wu, Yufeng et al. Current Situation and Prospect of Recovery and Utilization of Non-metal Materials of Waste Printed Circuit Board [J]. | Materials Reports , 2021 , 35 (7) : 7001-7012 . |
| MLA | Hao, Juanjuan et al. "Current Situation and Prospect of Recovery and Utilization of Non-metal Materials of Waste Printed Circuit Board" . | Materials Reports 35 . 7 (2021) : 7001-7012 . |
| APA | Hao, Juanjuan , Wang, Yishu , Wu, Yufeng , Guo, Fu . Current Situation and Prospect of Recovery and Utilization of Non-metal Materials of Waste Printed Circuit Board . | Materials Reports , 2021 , 35 (7) , 7001-7012 . |
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摘要 ：
Pulsed laser welding was used to join ultra thin Inconel 718 alloy foils whose thickness was 0.2 mm. A fixture was designed to obtain the edge joint. The joint geometry and hot cracking were both observed on the cross sections. The relationship between the height, width of the joint and the energy density were fitted as linear functions. The effect of heat input on the hot cracking in the edge joint was obtained. It was shown that a hot cracking occurred during the solidification of the molten metal under laser heating. The crack initiated at the gap between the foil pair and propagated along the Laves phase with low melting point. The crack length could be reduced by applying low heat input. Tearing tests were conducted to evaluate the influence of the cracking on the mechanical performance of edge joints. There existed two failure modes for the edge joint under a tear loading. When the crack length exceeds 106.9 μm the hot crack starts to propagate and the tear loading decreases with crack length increasing. A finite element model was established to simulate the stress evolution during the cooling stage. The main reason of crack initiation and propagation were both presented. © 2021 The Society of Manufacturing Engineers
关键词 ：
Cracks Cracks Liquid metals Liquid metals Pulsed lasers Pulsed lasers Welding Welding
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| GB/T 7714 | Lin, Jian , Wang, Xibo , Lei, Yongping et al. Study on hot cracking in laser welded joints of inconel 718 alloy foils [J]. | Journal of Manufacturing Processes , 2021 , 64 : 1024-1035 . |
| MLA | Lin, Jian et al. "Study on hot cracking in laser welded joints of inconel 718 alloy foils" . | Journal of Manufacturing Processes 64 (2021) : 1024-1035 . |
| APA | Lin, Jian , Wang, Xibo , Lei, Yongping , Wei, Ruigang , Guo, Fu . Study on hot cracking in laser welded joints of inconel 718 alloy foils . | Journal of Manufacturing Processes , 2021 , 64 , 1024-1035 . |
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摘要 ：
为了研究球栅陈列封装(ball grid array, BGA)焊点在高温、高电流密度条件下的电迁移损伤演化行为,基于COMSOL Multiphysics 5.5软件提出一种损伤记录方法来模拟电-热-力多物理场耦合的工况,分析电迁移空洞产生和扩展的过程.综合考虑了电子风力、温度梯度、应力梯度和原子浓度梯度4种原子扩散动力对原子迁移的作用.结果表明:电迁移过程中电子风力和原子浓度梯度对电迁移空洞的形成起着主要作用,随着损伤的积累,电流堆积因子不断提高,孔洞周围电子风力作用更加明显,相反,原子浓度梯度通量起到了抑制原子过度迁移的作用.环境温度会影响焊点原子扩散系数,较高的温度下原子扩散系数较大,...
关键词 ：
COMSOL Multiphysics COMSOL Multiphysics 损伤演化 损伤演化 有限元 有限元 球栅阵列封装(BGA) 球栅阵列封装(BGA) 电-热耦合 电-热耦合 电迁移 电迁移
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| GB/T 7714 | 郭福 , 文廷玉 , 马立民 et al. 高温高电流密度下BGA焊点电迁移损伤 [J]. | 北京工业大学学报 , 2021 , 47 (11) : 1264-1274 . |
| MLA | 郭福 et al. "高温高电流密度下BGA焊点电迁移损伤" . | 北京工业大学学报 47 . 11 (2021) : 1264-1274 . |
| APA | 郭福 , 文廷玉 , 马立民 , 王乙舒 , 王娇娇 . 高温高电流密度下BGA焊点电迁移损伤 . | 北京工业大学学报 , 2021 , 47 (11) , 1264-1274 . |
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摘要 ：
运用ANSYS软件,对热循环载荷下CQFP器件焊点的应力场和热疲劳寿命进行了分析研究,量化了引线肩宽和站高两种参数的影响规律。其中,焊料Sn63Pb37的力学行为采用Anand黏塑性本构模型进行描述,焊点热疲劳寿命通过Coffin-Manson寿命预测模型计算。结果表明,CQFP器件最大热应力出现在焊点根部最内侧的尖角处。引线站高对焊点热疲劳寿命影响不明显;引线肩宽对热疲劳寿命影响显著,引线肩宽大于0.9 mm时,焊点寿命下降明显。
关键词 ：
CQFP CQFP 引线参数 引线参数 热疲劳寿命 热疲劳寿命 仿真优化 仿真优化
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| GB/T 7714 | 吴仕锋 , 郭福 , 于方 et al. 引线参数对CQFP器件焊点热疲劳寿命的影响 [J]. | 电子工艺技术 , 2020 , 41 (02) : 106-109 . |
| MLA | 吴仕锋 et al. "引线参数对CQFP器件焊点热疲劳寿命的影响" . | 电子工艺技术 41 . 02 (2020) : 106-109 . |
| APA | 吴仕锋 , 郭福 , 于方 , 李思阳 . 引线参数对CQFP器件焊点热疲劳寿命的影响 . | 电子工艺技术 , 2020 , 41 (02) , 106-109 . |
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